IP Library Granted Patent US 9,271,095
Granted Patent B2
US 9,271,095 · App. 13/393,005 · Granted Feb 23, 2016

Hearing aid device and a method of manufacturing a hearing aid device

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Quick Facts
Patent No.
US 9,271,095
App. No.
13/393,005
Granted
Feb 23, 2016
Kind
B2
Abstract

A hearing aid device and a method of manufacturing the hearing aid device provide a housing and a first conductive layer. The housing has a first non-conductive layer and a second non-conductive layer. The first conductive layer is disposed between the first non-conductive layer and the second non-conductive layer.

Claims (48)

1. A hearing aid device, comprising:

a housing including a first non-conductive layer, a second non-conductive layer, and a third non-conductive layer, said second non-conductive layer having an inner surface, said third non-conductive layer disposed inwardly of said first non-conductive layer and outwardly of said second non-conductive layer;

a coil disposed and embedded between said third non-conductive layer and said first non-conductive layer;

a first conductive layer disposed between said first non-conductive layer and said second non-conductive layer;

a second conductive layer attached onto a portion of said inner surface of said second non-conductive layer; and

said inner surface of said second non-conductive layer acting as a support for said second conductive layer.

2. The hearing aid device according to claim 1 , which further comprises an electrical component to which said second conductive layer is conductively connected.

3. The hearing aid device according to claim 2 , wherein said electrical component is a printed electrical component.

4. The hearing aid device according to claim 1 , wherein said first conductive layer and said second conductive layer are solid freeform fabricated layers selected from the group consisting of:

an inkjet printed layer,

a pneumatic sprayed layer,

a screen printed layer,

a pad printed layer,

a laser printed layer,

a dot matrix printed layer,

a thermal printed layer,

a lithographic layer, and

a 3D printed layer.

5. The hearing aid device according to claim 1 , wherein said first conductive layer and said second conductive layer include an element selected from the group consisting of:

copper,

gold,

silver, and

electrically conductive polymer.

6. A method for manufacturing a hearing aid device, the method comprising the following steps:

producing a housing of the hearing aid device having a first non-conductive layer, a second non-conductive layer, and a third non-conductive layer disposed inwardly of the first non-conductive layer and outwardly of the first non-conductive layer;

embedding a coil between the first non-conductive layer and the third non-conductive layer;

embedding a first conductive layer between the first non-conductive layer and the second non-conductive layer;

attaching a second conductive layer onto an inner surface of the second non-conductive layer; and

supporting the second conductive layer on the inner surface of the second non-conductive layer.

7. The method according to claim 6 , which further comprises embedding the first conductive layer between the first non-conductive layer and the second non-conductive layer by a solid freeform technique selected from the group consisting of:

inkjet printing,

pneumatic spraying,

screen printing,

pad printing,

laser printing,

dot matrix printing,

thermal printing,

lithography, and

3D printing.

8. The method according to claim 6 , which further comprises conductively connecting an electrical component to the second conductive layer.

9. The method according to claim 8 , which further comprises providing the electrical component as a printed electrical component.

10. The method according to claim 6 , which further comprises including in the first conductive layer, the second conductive layer and the coil an element selected from the group consisting of:

copper,

gold,

silver, and

electrically conductive polymer.

11. The hearing aid device according to claim 1 , wherein said second conductive layer extends over a substantial surface area of said inner surface of said second non-conductive layer.

12. The method according to claim 6 , wherein the second conductive layer extends over a substantial surface area of the inner surface of the second non-conductive layer.

Assignments (2)
CHANGE OF NAME Recorded Jul 10, 2015
From: SIEMENS MEDICAL INSTRUMENTS PTE. LTD.
To: SIVANTOS PTE. LTD.
Reel/Frame 036089/0827 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2012
From: BECK, FRANK; KRISTY LIM, PEI CHYI; DE FINIS, JAMES EDWARD; RASS, UWE; SAUER, JOSEPH; VAZE, AMIT; LAMBA, LAVLESH; HOLST, JENS-CHRISTIAN
To: SIEMENS MEDICAL INSTRUMENTS PTE LTD.
Reel/Frame 028612/0877 →