Hearing aid device and a method of manufacturing a hearing aid device
View Patent ↗A hearing aid device and a method of manufacturing the hearing aid device provide a housing and a first conductive layer. The housing has a first non-conductive layer and a second non-conductive layer. The first conductive layer is disposed between the first non-conductive layer and the second non-conductive layer.
1. A hearing aid device, comprising:
a housing including a first non-conductive layer, a second non-conductive layer, and a third non-conductive layer, said second non-conductive layer having an inner surface, said third non-conductive layer disposed inwardly of said first non-conductive layer and outwardly of said second non-conductive layer;
a coil disposed and embedded between said third non-conductive layer and said first non-conductive layer;
a first conductive layer disposed between said first non-conductive layer and said second non-conductive layer;
a second conductive layer attached onto a portion of said inner surface of said second non-conductive layer; and
said inner surface of said second non-conductive layer acting as a support for said second conductive layer.
2. The hearing aid device according to claim 1 , which further comprises an electrical component to which said second conductive layer is conductively connected.
3. The hearing aid device according to claim 2 , wherein said electrical component is a printed electrical component.
4. The hearing aid device according to claim 1 , wherein said first conductive layer and said second conductive layer are solid freeform fabricated layers selected from the group consisting of:
an inkjet printed layer,
a pneumatic sprayed layer,
a screen printed layer,
a pad printed layer,
a laser printed layer,
a dot matrix printed layer,
a thermal printed layer,
a lithographic layer, and
a 3D printed layer.
5. The hearing aid device according to claim 1 , wherein said first conductive layer and said second conductive layer include an element selected from the group consisting of:
copper,
gold,
silver, and
electrically conductive polymer.
6. A method for manufacturing a hearing aid device, the method comprising the following steps:
producing a housing of the hearing aid device having a first non-conductive layer, a second non-conductive layer, and a third non-conductive layer disposed inwardly of the first non-conductive layer and outwardly of the first non-conductive layer;
embedding a coil between the first non-conductive layer and the third non-conductive layer;
embedding a first conductive layer between the first non-conductive layer and the second non-conductive layer;
attaching a second conductive layer onto an inner surface of the second non-conductive layer; and
supporting the second conductive layer on the inner surface of the second non-conductive layer.
7. The method according to claim 6 , which further comprises embedding the first conductive layer between the first non-conductive layer and the second non-conductive layer by a solid freeform technique selected from the group consisting of:
inkjet printing,
pneumatic spraying,
screen printing,
pad printing,
laser printing,
dot matrix printing,
thermal printing,
lithography, and
3D printing.
8. The method according to claim 6 , which further comprises conductively connecting an electrical component to the second conductive layer.
9. The method according to claim 8 , which further comprises providing the electrical component as a printed electrical component.
10. The method according to claim 6 , which further comprises including in the first conductive layer, the second conductive layer and the coil an element selected from the group consisting of:
copper,
gold,
silver, and
electrically conductive polymer.
11. The hearing aid device according to claim 1 , wherein said second conductive layer extends over a substantial surface area of said inner surface of said second non-conductive layer.
12. The method according to claim 6 , wherein the second conductive layer extends over a substantial surface area of the inner surface of the second non-conductive layer.