Semiconductor device, and method for supplying electric power to same
View Patent ↗Disclosed is a liquid crystal driver having a plurality of output cells ( 101 ), wherein operational amplifiers ( 105 ), which are components of the output cells ( 101 ), are connected to a power wire ( 109 a ) formed in the liquid crystal driver, which is a semiconductor element. Further, the semiconductor element is mounted on a substrate on which a bypass wire ( 201 ) has been formed. The bypass wire ( 201 ) is connected to the power wire ( 109 a ) through bumps ( 203 ) for each separate one of the operational amplifiers ( 105 ) of all of the output cells.
1. A semiconductor device having a semiconductor element mounted on a substrate,
the semiconductor element comprising:
a plurality of output cells having plural types of component; and
a plurality of power wires through which electric power is supplied to the types of component of all of the output cells, respectively,
the substrate comprising a bypass wire,
the bypass wire being connected to at least one of the power wires and having connection terminals for each separate one of those components of substantially all of the output cells which are connected to the at least one of the power wires.
2. The semiconductor device as set forth in claim 1 , wherein:
the output cells include output buffers; and
the connection terminals are disposed on that one of the power wires which is connected to a power supply for the output buffers.
3. The semiconductor device as set forth in claim 2 , wherein the output buffers are operational amplifiers.
4. The semiconductor device as set forth in claim 3 , wherein the connection terminals are disposed on that one of the power wires which is connected to last output stages of the operation amplifiers.
5. The semiconductor device as set forth in claim 1 , wherein the semiconductor element is a driving integrated circuit of a display device.
6. A method for supplying electric power to a semiconductor device having a semiconductor element mounted on a substrate,
the semiconductor element comprising:
a plurality of output cells having plural types of component; and
a plurality of power wires through which electric power is supplied to the types of component of all of the output cells, respectively,
the substrate comprising a bypass wire,
the method comprising connecting the bypass wire to each separate one of those components of substantially all of the output cells which are connected to at least one of the power wires and thereby supplying electric power to those components through the bypass wire.
7. The method as set forth in claim 6 , wherein:
the output cells include output buffers; and
the connection terminals are disposed on that one of the power wires which is connected to a power supply for the output buffers.
8. The method as set forth in claim 7 , wherein the output buffers are operational amplifiers.
9. The method as set forth in claim 8 , wherein the connection terminals are disposed on that one of the power wires which is connected to last output stages of the operation amplifiers.