Film made of polyaryleetherketone
View Patent ↗The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 μm, which is suitable for producing dimensionally stable circuit boards.
1. A foil, comprising a layer of a molding composition, comprising:
from 60 to 96 parts by weight of polyarylene ether ketone,
from 2 to 25 parts by weight of hexagonal boron nitride, and
from 2 to 25 parts by weight of talc,
based on 100 total parts by weight of polyarylene ether ketone, hexagonal boron nitride, and talc,
wherein
a d 50 particle size of the boron nitride to ISO 13320 is at least 0.1 μm and at most 10 μm, and a corresponding d 98 is at least 0.3 μm and at most 20 μm,
a d 50 particle size of the talc to ISO 13317, Part 3 is at least 0.1 μm and at most 10 μm, and a corresponding d 98 is at least 0.3 μm and at most 20 μm the polyarylene ether ketone comprises a unit of formula:
(—Ar—X—)
and a unit of the formula:
(—Ar′—Y—),
wherein Ar and Ar′ are each independently a divalent aromatic moiety,
each X is independently an electron-withdrawing group,
at least 50% of X groups are carbonyl groups,
each Y is independently O, S, CH 2 , or isopropylidene, and
at least 50% of Y groups are O; and
the layer of the molding composition has a thickness of 5 to 100 μm and has a dimensional change of less than 0.1% in both a longitudinal and transverse direction at temperatures up to 260° C.
2. The foil of claim 1 , comprising:
from 75 to 90 parts by weight of polyarylene ether ketone,
from 8 to 16 parts by weight of hexagonal boron nitride, and
from 8 to 16 parts by weight of talc.
3. The foil of claim 1 ,
wherein Ar and Ar′ are each independently 1,4-phenylene; 4,4′-biphenylene; 1,4-naphthylene; 1,5-naphthylene; or 2,6-naphthylene.
4. The foil of claim 1 ,
wherein at least 70% of X is a carbonyl group, and
at least 70% of Y is O.
5. The foil of claim 1 ,
wherein the polyarylene ether ketone is a polyether ether ketone (PEEK), a polyether ketone (PEK), a polyether ketone ketone (PEKK), or a polyether ether ketone ketone (PEEKK).
6. The foil of claim 1 ,
wherein a d 50 particle size of the boron nitride to ISO 13320 is at least 0.4 μm and at most 6 μm.
7. The foil of claim 1 ,
wherein a d 50 particle size of the talc to ISO 13317, Part 3 is at least 0.4 μm and at most 5 μm.
8. The foil of claim 1 , further comprising:
a silane, an oligomeric siloxane, or both.
9. The foil of claim 1 , wherein the thickness of the foil is from 10 μm to 100 μm.
10. The foil of claim 1 , further comprising:
a metal layer.
11. The foil of claim 10 , wherein a thickness of the metal layer is from 0.1 to 150 μm.
12. The foil of claim 10 , wherein the foil is obtained by a process comprising laminating, electrolytically applying, or vacuum depositing the metal layer.
13. The foil of claim 10
wherein the metal layer comprises copper or aluminum.
14. The foil of claim 1 , further comprising:
a conductive paste.
15. A process for producing the foil of claim 1 , comprising:
mixing, in a melt, from 60 to 96 parts by weight of polyarylene ether ketone, from 2 to 25 parts by weight of hexagonal boron nitride, and from 2 to 25 parts by weight of talc, based on a total of 100 parts by weight of polyarylene ether ketone, hexagonal boron nitride, and talc,
extruding the melt in a slot die to obtain a foil web, and
placing the foil web onto a chill roll to harden the web.
16. The process of claim 15 ,
wherein the extruding directly follows the mixing in the same machine.