IP Library Patent Application 13395914
Patent Application
App. No. 13/395,914

THERMALLY-CONDUCTIVE ORGANIC ADDITIVE, RESIN COMPOSITION, AND CURED PRODUCT

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Patent No.
US None
App. No.
13/395,914
Abstract

The present invention provides a thermally-conductive organic additive which (i) is an organic polymer, unlike a thermally-conductive inorganic filler such as ceramic, metal and a carbon material, (ii) is capable of imparting thermal conductivity to plastic by being added thereto, (iii) can reduce the weight of a composition even when added to a resin in a large amount, without causing abrasion on molds and deteriorating an electrical insulation property of the composition, and (iv) provides the composition with excellent molding processability. The present thermally-conductive organic additive includes a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-  (1) wherein M represents a mesogenic group; and Sp represents a spacer, the liquid crystalline thermoplastic resin itself having thermal conductivity of not less than 0.45 W/(m·K).

Claims (32)

1 . A thermally-conductive organic additive comprising a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1):

-M-Sp-  (1)

wherein M represents a mesogenic group; and Sp represents a spacer,

the liquid crystalline thermoplastic resin per se having a thermal conductivity of not less than 0.45 W/(m·K).

2 . The thermally-conductive organic additive as set forth in claim 1 , wherein the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (2):

-A 1 -x-A 2 -y-R-z-  (2)

wherein each of A 1 and A 2 independently represents a substituent group selected from an aromatic group, a condensed aromatic group, an alicyclic group, and an alicyclic heterocyclic group; each of x, y and z independently represents a direct bond, or a bivalent substituent group selected from the group consisting of —CH 2 —, —C(CH 3 ) 2 —, —O—, —S—, —CH 2 —CH 2 —, —C═C—, —C≡C—, —CO—, —CO—O—, —CO—NH—, —CH═N—, —CH═N—N═CH—, —N═N—, and —N(O)═N—; and R represents a bivalent substituent group which has a main chain length of 2 to 20 atoms and may be branched.

3 . The thermally-conductive organic additive as set forth in claim 2 , wherein -A 1 -x-A 2 - of the liquid crystalline thermoplastic resin is a mesogenic group represented by the general formula (3):

wherein X independently represents an aliphatic hydrocarbon group, F, Cl, Br, I, CN, or NO 2 ; n is an integer of 0 to 4; and m is an integer of 2 to 4.

4 . The thermally-conductive organic additive as set forth in claim 2 , wherein R of the liquid crystalline thermoplastic resin is a linear aliphatic hydrocarbon chain.

5 . The thermally-conductive organic additive as set forth in claim 4 , wherein R of the liquid crystalline thermoplastic resin has a main chain length of even-numbered carbon atoms.

6 . The thermally-conductive organic additive as set forth in claim 4 , wherein R of the liquid crystalline thermoplastic resin is of at least one kind selected from —(CH 2 ) 8 —, —(CH 2 ) 10 —, and —(CH 2 ) 12 —, the liquid crystalline thermoplastic resin having a number average molecular weight of 3000 to 40000.

7 . The thermally-conductive organic additive as set forth in claim 2 , wherein -y-R-z- of the liquid crystalline thermoplastic resin is —O—CO—R—CO—O—.

8 . A thermally-conductive organic additive containing resin composition comprising a thermally-conductive organic additive (A) as recited in claim 1 and an organic polymer (B), wherein the thermally-conductive organic additive (A) is added in 1 part by weight to 10000 parts by weight with respect to 100 parts by weight of the organic polymer (B).

9 . The thermally-conductive organic additive as set forth in claim 1 , wherein the liquid crystalline thermoplastic resin contains lamellar crystals by not less than 10 Vol %.

10 . The thermally-conductive organic additive as set forth in claim 1 , wherein the liquid crystalline thermoplastic resin has a crystallinity of not less than 7 Vol %.

11 . A resin composition comprising:

(A) a liquid crystalline thermoplastic resin having a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1):

-M-Sp-  (1)

wherein M represents a mesogenic group; and Sp represents a spacer;

(B) a thermoplastic resin other than the liquid crystalline thermoplastic resin (A); and

(C) an inorganic filler,

wherein (A) and (B) are comprised in a weight ratio of 10:90 to 90:10 in the resin composition.

12 . The resin composition as set forth in claim 11 , wherein the liquid crystalline thermoplastic resin (A) contains lamellar crystals by not less than 10 Vol %.

13 . The resin composition as set forth in claim 11 , wherein the liquid crystalline thermoplastic resin (A) has a crystallinity of not less than 7 Vol %.

14 . A resin composition comprising:

(A) a thermally-conductive organic additive comprising a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1):

-M-Sp-  (1)

wherein M represents a mesogenic group; and Sp represents a spacer;

(B) a thermosetting resin; and

(C) an inorganic filler.

15 . A cured product obtained from a resin composition as recited in claim 14 .

Assignments (2)
CHANGE OF ADDRESS Recorded Sep 12, 2013
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 031207/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2012
From: YOSHIHARA, SHUSUKE; MATSUMOTO, KAZUAKI
To: KANEKA CORPORATION
Reel/Frame 027860/0256 →