Electrode sintered body, multilayer electronic device, internal electrode paste, a manufacturing method of electrode sintered body and a manufacturing method of multilayer electronic device
View Patent ↗An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.
1. An electrode sintered body comprising an intermetallic compound comprising Ni 3 Al and NiAl, wherein:
a ratio of total intermetallic compound with respect to 100 mass % of the electrode sintered body is 30 to 100 mass %; and
a ratio of Ni 3 Al with respect to 100 mass % of the electrode sintered body is 5 mass % or more.
2. The electrode sintered body as set forth in claim 1 , wherein a ratio of NiAl with respect to 100 mass % of the electrode sintered body is 2 mass % or more.
3. A multilayer electronic device comprising a stacked body in which a plural number of dielectric layers and internal electrode layers are alternately laminated, wherein the internal electrode layers comprise the electrode sintered body as set forth in claim 1 .
4. An internal electrode paste comprising a conducting particle material, a binder, and a solvent, wherein the conducting particle material comprises nickel particles and an intermetallic compound comprising nickel and aluminium, and a ratio of total intermetallic compound with respect to 100 mass % of the conducting particle material is 30 to up to but not including 100 mass %.
5. The internal electrode paste as set forth in claim 4 , wherein the intermetallic compound comprises at least one of NiAl and Ni 3 Al.
6. The internal electrode paste as set forth in claim 4 , wherein the intermetallic compound comprises NiAl, and a ratio of NiAl with respect to 100 mass % of the conducting particle material is 5 mass % or more.
7. The internal electrode paste as set forth in claim 4 , wherein the intermetallic compound comprises Ni 3 Al, and a ratio of Ni 3 Al with respect to 100 mass % of the conducting particle material is 5 mass % or more.
8. A method of manufacturing an electrode sintered body comprising:
obtaining an electrode preform by coating the internal electrode paste as set forth in claim 4 on a substrate, and
firing the electrode preform.
9. A method of manufacturing a multilayer electronic device comprising:
obtaining a stacked body in which a plural number of green sheets, including dielectric powder and binder, and internal electrode sheets, from the internal electrode paste as set forth in claim 4 ,
alternately laminating the green sheets and the internal electrode sheets, and
firing the stacked body.