AlGaInN-based lasers produced using etched facet technology
View Patent ↗A process for fabricating AlGaInN-based photonic devices, such as lasers, capable of emitting blue light employs dry etching to form device waveguides and mirrors. The dry etching is preferably performed using a Chemically Assisted Ion Beam Etching (CAIBE) system.
1. A method for fabricating a laser, comprising the steps of:
epitaxially depositing an AlGaInN-based structure including an active region on a substrate; and
dry etching using a system containing an ion beam source generating an ion beam directed towards said substrate:
a first facet in said AlGaInN-based structure;
a second facet in said AlGaInN-based structure; and
a ridge waveguide along a top surface of said AlGaInN-based structure above said active region for providing lateral waveguiding for said laser, said ridge waveguide being located between said first and second facets, said first facet being formed at and extending across a first end of said AlGaInN-based structure and said ridge waveguide in a single plane at or around 90-degrees to said substrate.
2. The method of claim 1 , wherein said dry etching is performed using a Chemically Assisted Ion Beam Etching (CAIBE) system.
3. The method of claim 1 , wherein said second facet is at or around 90-degrees to said substrate.
4. The method of claim 1 , wherein said second facet is at or around 45-degrees to said substrate.
5. The method of claim 1 , further comprising the step of forming a contact on a p-doped cap layer.
6. A method for fabricating a laser, comprising the steps of:
epitaxially depositing on a substrate an AlGaInN-based structure including an active region and a p-doped cap layer at a top surface of said structure;
dry etching a first facet in said AlGaInN-based structure;
dry etching a second facet in said AlGaInN-based structure;
dry etching a ridge waveguide along a top surface of said AlGaInN-based structure above said active region for providing lateral waveguiding for said laser, said ridge waveguide being located between said first and second facets;
depositing a dielectric above said ridge waveguide and covering said p-doped cap layer; and
forming an opening using both dry etching and wet etching in said dielectric, exposing said p-doped cap layer.
7. The method of claim 6 , wherein said dry etching is performed using a Chemically Assisted Ion Beam Etching (CAIBE) system.
8. The method of claim 6 , wherein the length of the ridge waveguide between said first and second facets is 100 μm or less.
9. The method of claim 6 , wherein said dielectric completely encapsulates said etched facets.
10. The method of claim 6 , further comprising forming a contact on said p-doped cap layer.
11. A method of fabricating a photonic device, comprising the steps of:
epitaxially depositing an AlGaInN-based structure including an active region on a substrate;
dry etching a first facet in said AlGaInN-based structure; and
dry etching a ridge waveguide along a top surface of said AlGaInN-based structure above said active region for providing lateral waveguiding, said first facet being formed at and extending across a first end of said AlGaInN-based structure and said ridge waveguide in a single plane at or around 90-degrees to said substrate.
12. The method of claim 11 , further comprising the step of dry etching a second facet in said AlGaInN-based structure.
13. The method of claim 12 , wherein said second facet is at or around 90-degrees to said substrate.
14. The method of claim 12 , wherein said second facet is at or around 45-degrees to said substrate.
15. The method of claim 14 , wherein the distance between said first and second facets is 100 μm or less.
16. A method of fabricating a photonic device, comprising the steps of:
epitaxially depositing on a substrate an AlGaInN-based structure including an active region and a p-doped cap layer at a top surface of said structure;
dry etching a first facet in said AlGaInN-based structure;
dry etching a ridge waveguide along a top surface of said AlGaInN-based structure above said active region for providing lateral waveguiding for said laser;
depositing a dielectric above said ridge waveguide and covering said p-doped cap layer; and
forming an opening using both dry etching and wet etching in said dielectric, exposing said p-doped cap layer.
17. The method of claim 16 , wherein said dry etching is performed using a Chemically Assisted Ion Beam Etching (CAIBE) system.
18. The method of claim 16 , wherein the length of the ridge waveguide between said first and second facets is 100 μm or less.
19. The method of claim 16 , wherein said dielectric completely encapsulates said etched facets.
20. The method of claim 16 , further comprising the step of forming a contact on said p-doped cap layer.