Wiring board and manufacturing method thereof
View Patent ↗The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.
1. A manufacturing method of a wiring board made of a fiber reinforced resin plate formed of matrix resin and a glass fiber portion and having a through hole, the manufacturing method comprising the steps of:
a reinforced fiber removing step which removes a forming portion of the through hole and a surrounding portion thereof from a prepreg forming the fiber reinforced resin plate;
a pressing forming step which presses the prepreg of the fiber reinforced resin plate in which the prepeg of the forming portion of the through hole and the surrounding portion thereof has been removed and causes matrix resin included in the prepeg to flow toward the forming portion, such that the forming portion is subsequently made only with the matrix resin and integrally formed in the fiber reinforced resin plate; and
a forming step which forms the through hole in the forming portion,
wherein the through hole is substantially surrounded by only the matrix resin, which is positioned between the through hole and the glass fiber portion, and configured to receive a terminal press-fit therethrough.