Semiconductor device and method for manufacturing same
View Patent ↗A semiconductor device includes (i) a tape base material, (ii) a wiring pattern, (iii) a semiconductor element which is electrically connected with the wiring pattern, (iv) a top-side insulating protective film which covers a top surface of the tape base material and has an top-side opening section provided in a region where the top-side insulating protective film faces the semiconductor element, and (v) a reverse-side insulating protective film which covers a reverse surface of the tape base material and has a reverse-side opening section provided on a reverse side below the top-side opening section. The top-side insulating protective film has a protruding opening section extending outwardly from the region. An opening of the reverse-side opening section is 1.00 time to 8.50 times larger in an area than the region.
1. A semiconductor device, which is a tape carrier semiconductor device including a semiconductor element provided on a top surface of a tape base material so as to be electrically connected with a wiring pattern provided on the top surface of the tape base material, the semiconductor device comprising:
a top-side insulating protective film covering the top surface of the tape base material; and
a reverse-side insulating protective film covering a reverse surface of the tape base material,
the top-side insulating protective film having (i) a top-side opening section opening in at least a part of a region where the top surface of the tape base material faces the semiconductor element and (ii) a protruding opening section outwardly extending from the region,
the reverse-side insulating protective film having a reverse-side opening section opening on a reverse side below the top-side opening section,
an opening of the reverse-side opening section being more than 1.00 time to not more than 8.50 times larger in an area than the region where the top surface of the tape base material faces the semiconductor element, and
a filling agent filling a gap between the semiconductor element and the tape base material in the region where the top surface of the tape base material faces the semiconductor element.
2. The semiconductor device as set forth in claim 1 , wherein:
the semiconductor element and the top-side opening section have respective rectangular shapes; and
each side of the rectangular shape of the top-side opening section is shorter in a length than a combined length of (i) a length of a corresponding side of the rectangular shape of the semiconductor element and (ii) a length of 0.50 mm.
3. The semiconductor device as set forth in claim 1 , wherein
the protruding opening section outwardly extends, by 0.4 mm to 1.0 mm, from an end part of the region where the top surface of the tape base material faces the semiconductor element.
4. The semiconductor device as set forth in claim 1 , wherein:
the wiring pattern has an extending section provided in the top-side opening section provided on a top surface side of the tape base material; and
the extending section has a width of 0.05 mm to 0.20 mm and extends from a connection part of the wiring pattern and the semiconductor element toward a center part of the top-side opening section.
5. The semiconductor device as set forth in claim 1 , comprising:
a thin film having a thickness of 5 μm to 30 μm being provided on that part of the top-side insulating protective film which (a) surrounds the top-side opening section and (b) extends from an end part of the top-side opening section by 2 mm to 3 mm.
6. The semiconductor device as set forth in claim 1 , wherein the protruding section has a substantially circular shape and is provided at at least one corner part of the top-side opening section.
7. The semiconductor device as set forth in claim 1 , wherein the wiring pattern includes an extending section which extends inwardly from a region to which an electrode of the semiconductor element is located to a substantially center region of the top-side opening section.