THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
A thin film transistor array panel includes a gate electrode on an insulating substrate, a gate insulating layer on the gate electrode, a semiconductor on the gate insulating layer, a thin film transistor including a source electrode and a drain electrode on the oxide semiconductor, and a pixel electrode which is connected to the drain electrode. The semiconductor includes a first layer having a relatively low fluorine content and a second layer having a relatively high fluorine content. The second layer of the semiconductor is only between the first layer of the semiconductor and the source electrode, and between the first layer of the semiconductor and the drain electrode.
1 . A thin film transistor array panel, comprising:
a gate electrode on an insulating substrate;
a gate insulating layer on the gate electrode;
a semiconductor on the gate insulating layer and including fluorine;
a source electrode and a drain electrode on the semiconductor; and
a pixel electrode which is connected to the drain electrode,
wherein
the semiconductor includes a first layer having a relatively low fluorine content and a second layer having a relatively high fluorine content, and
the first layer of the semiconductor is between the source electrode and the drain electrode.
2 . The thin film transistor array panel of claim 1 , wherein:
the second layer of the semiconductor is only between the first layer of the semiconductor and the source electrode, and between the first layer of the semiconductor and the drain electrode.
3 . The thin film transistor array panel of claim 1 , wherein:
the semiconductor comprises an oxide semiconductor.
4 . The thin film transistor array panel of claim 3 , wherein:
the oxide semiconductor comprises indium (In).
5 . The thin film transistor array panel of claim 4 , wherein:
the source electrode and the drain electrode each comprise a first layer and a second layer, and
the first layer of the source electrode and the drain electrode comprises titanium (Ti), gallium (Ga), zinc (Zn), magnesium (Mg), manganese (Mn), tantalum (Ta), or chromium (Cr).
6 . The thin film transistor array panel of claim 5 , wherein:
plane shapes of the semiconductor, the source electrode, and the drain electrode are substantially similar to each other with the exception of a channel portion of the semiconductor.
7 . The thin film transistor array panel of claim 1 , wherein:
the source electrode and the drain electrode each comprise a first layer and a second layer, and
the first layer of the source electrode and the drain electrode comprises titanium (Ti), gallium (Ga), zinc (Zn), magnesium (Mg), manganese (Mn), tantalum (Ta), or chromium (Cr).
8 . The thin film transistor array panel of claim 7 , wherein:
plane shapes of the semiconductor, the source electrode, and the drain electrode are substantially the same to each other with the exception of a channel portion of the thin film transistor.
9 . The thin film transistor array panel of claim 1 , wherein:
plane shapes of the semiconductor, the source electrode, and the drain electrode are substantially the same to each other with the exception of a channel portion of the thin film transistor.
10 . A method for manufacturing a thin film transistor array panel, the method comprising:
forming a gate electrode on an insulating substrate;
layering a gate insulating layer on the gate electrode;
forming a semiconductor including a first layer and a second layer, on the gate insulating layer;
forming a source electrode and a drain electrode on the semiconductor;
removing the second layer of the semiconductor disposed between the source electrode and the drain electrode; and
forming a pixel electrode connected to the drain electrode.
11 . The method of claim 10 , wherein:
the forming of the semiconductor comprises:
layering an oxide semiconductor on the gate insulating layer, and
forming the second layer of the oxide semiconductor and the first layer of the oxide semiconductor by treating a surface of the oxide semiconductor with a fluorine plasma, and
the first layer of the oxide semiconductor has a relatively low fluorine content, and the second layer of the oxide semiconductor has a relatively high fluorine content.
12 . The method of claim 11 , wherein:
the oxide semiconductor comprises indium (In).
13 . The method of claim 12 , wherein:
the forming of the semiconductor, and the forming of the source electrode and the drain electrode are simultaneously implemented by using one mask.
14 . The method of claim 13 , wherein:
the removing of the second layer of the semiconductor between the source electrode and the drain electrode is simultaneously implemented with the forming of the semiconductor and the forming of the source electrode and the drain electrode by using the one mask.
15 . The method of claim 14 , wherein:
the source electrode and the drain electrode each comprise a first layer and a second layer, and
the first layer of the source electrode and the drain electrode comprises titanium (Ti), gallium (Ga), zinc (Zn), magnesium (Mg), manganese (Mn), tantalum (Ta), or chromium (Cr).
16 . The method of claim 10 , wherein:
the semiconductor comprises an oxide semiconductor, and
the oxide semiconductor comprises indium (In).
17 . The method of claim 16 , wherein:
the forming of the semiconductor, and the forming of the source electrode and the drain electrode are simultaneously implemented by using one mask.
18 . The method of claim 17 , wherein:
the removing of the second layer of the semiconductor between the source electrode and the drain electrode is simultaneously implemented with the forming of the semiconductor and the forming of the source electrode and the drain electrode by using the one mask.
19 . The method of claim 18 , wherein:
the source electrode and the drain electrode each comprise a first layer and a second layer, and
the first layer of the source electrode and the drain electrode comprises titanium (Ti), gallium (Ga), zinc (Zn), magnesium (Mg), manganese (Mn), tantalum (Ta), or chromium (Cr).
20 . The method of claim 10 , wherein:
the forming of the semiconductor, and the forming of the source electrode and the drain electrode are simultaneously implemented by using one mask.
21 . The method of claim 20 , wherein:
the removing of the second layer of the semiconductor between the source electrode and the drain electrode is simultaneously implemented with the forming of the semiconductor and the forming of the source electrode and the drain electrode by using the one mask.
22 . The method of claim 21 , wherein:
the source electrode and the drain electrode each comprise a first layer and a second layer, and
the first layer of the source electrode and the drain electrode comprises titanium (Ti), gallium (Ga), zinc (Zn), magnesium (Mg), manganese (Mn), tantalum (Ta), or chromium (Cr).
23 . The method of claim 10 , wherein:
the source electrode and the drain electrode each comprise a first layer and a second layer, and
the first layer of the source electrode and the drain electrode comprises titanium (Ti), gallium (Ga), zinc (Zn), magnesium (Mg), manganese (Mn), tantalum (Ta), or chromium (Cr).
24 . A thin film transistor substrate, comprising:
a gate electrode;
a gate insulating layer which covers the gate electrode;
an oxide semiconductor on the gate insulating layer and including fluorine;
a source electrode which contacts a side of the oxide semiconductor; and
a drain electrode which contacts another side of the oxide semiconductor and is spaced apart from the source electrode,
wherein the oxide semiconductor comprises:
a first region having a relatively low fluorine content and contacting the gate insulating layer, and
a second region having a relatively high fluorine content and contacting the source electrode and drain electrode.