Sensor assembly and sensor module
View Patent ↗A purpose is to provide a sensor assembly and a sensor module having a flexible sensor element that uses polymer material and having a component such as the sensor element and the like that hardly deteriorates and is superior in durability. A sensor assembly includes a sensor element and an exterior packaging bag enclosing the sensor element. The sensor element includes a sensor thin film made of resin or elastomer, and at least one pair of electrodes connected to the sensor thin film. The exterior packaging bag is made from laminate films having a metal foil and two resin layers arranged sandwiching the metal foil.
1. A sensor assembly comprising:
a sensor element; and
an exterior packaging bag enclosing the sensor element,
the sensor element comprising:
a sensor thin film comprising one of resin and elastomer, the sensor thin film further comprising cracks;
at least one pair of electrodes connected to the sensor thin film; and
an elastically deformable cover film covering the sensor thin film, wherein
the exterior packaging bag comprises a laminate film having a metal foil and two resin layers sandwiching the metal foil,
the cracks are provided in advance and extend in a direction such that conductive paths in the sensor thin film are cut off when a bending deformation occurs.
2. The sensor assembly according to claim 1 , wherein, of the two resin layers, an inner resin layer arranged on an inner side has a melting point lower than a melting point of an outer resin layer arranged on an outer side.
3. The sensor assembly according to claim 2 , wherein the outer resin layer comprises at least one selected from polyphenylene sulfide, polyethylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, polyamide, polycarbonate, polyoxymethylene, polymethylmethacrylate, polyvinyl chloride resin, fluorine resin, and ethylene-vinyl alcohol copolymer resin.
4. The sensor assembly according to claim 1 , wherein the metal foil comprises at least one selected from aluminum, tin, copper, stainless steel, and zinc.
5. The sensor assembly according to claim 1 , wherein a film member is interposed between the exterior packaging bag and the sensor element, the film member having a friction coefficient smaller than that of at least one of an inner surface of the exterior packaging bag and an outermost surface of the sensor element.
6. The sensor assembly according to claim 1 , wherein
the sensor thin film comprises a conductive filler filled in parent material of one of the resin and the elastomer; and
the sensor element further comprises an insulating base material arranged on a surface of the sensor thin film, and detects an input load based on a change in electrical resistance due to deformation of the sensor thin film.
7. The sensor assembly according to claim 6 , wherein
the sensor element further comprises an elastic plate, which is arranged on the sensor thin film side or the base material side, and which elastically deforms due to an input load, thereby causing the sensor thin film to undergo bending deformation; and
the sensor element detects the input load based on a change in electrical resistance due to the bending deformation of the sensor thin film.
8. The sensor assembly according to claim 6 , wherein
the sensor element further comprises a load transmitting plate arranged on a load input side of the sensor thin film;
the load transmitting plate has a plurality of convex portions having curved surface shapes; and
the input load is transmitted to the sensor thin film via the plurality of convex portions.
9. The sensor assembly according to claim 1 , wherein
the sensor thin film comprises the elastomer;
the pair of electrodes are arranged across the sensor thin film; and
the sensor element detects an input load based on a change in capacitance between the pair of electrodes.
10. The sensor assembly according to claim 1 , wherein the cracks are provided such that the conductive paths are provided in the sensor thin film in a no-load state before the bending deformation occurs, and the cracks are opened up to cut off the conductive paths when the bending deformation occurs.
11. A sensor assembly comprising:
a sensor element; and
an exterior packaging bag enclosing the sensor element,
the sensor element comprising:
a sensor thin film comprising one of resin and elastomer, the sensor thin film further comprising cracks; and
at least one pair of electrodes connected to the sensor thin film,
wherein the exterior packaging bag comprises a laminate film having a metal foil and two resin layers sandwiching the metal foil,
the sensor thin film comprises conductive filler filled at a filling rate of 30% or more by volume in a resin parent material;
three-dimensional conductive paths are provided in the sensor thin film via contact among particles of the conductive filler; and
the sensor element further comprises an insulating base material on a surface of the sensor thin film, and detects deformation of a measured object based on an increase in electrical resistance due to a bending deformation of the sensor thin film,
the sensor element further comprises an elastically deformable cover film covering the sensor thin film; and
the cracks are provided in advance and extend in a direction such that the conductive paths are cut off when a bending deformation occurs.
12. The sensor assembly according to claim 11 , wherein the cracks are provided such that the conductive paths are provided in the sensor thin film in a no-load state before the bending deformation occurs, and the cracks are opened up to cut off the conductive paths when the bending deformation occurs.
13. A sensor module comprising:
a sensor assembly; and
a circuit case on which the sensor assembly is installed, wherein
the sensor assembly comprises:
a sensor element; and
an exterior packaging bag enclosing the sensor element,
the sensor element comprises:
a sensor thin film comprising one of resin and elastomer; and
at least one pair of electrodes connected to the sensor thin film,
the exterior packaging bag comprises a laminate film having a metal foil and two resin layers sandwiching the metal foil
the exterior packaging bag of the sensor assembly has an opening;
the sensor element has a wiring unit projecting out of the exterior packaging bag from the opening; and
the circuit case has a box-like shape and comprises
a case body on which an assembly mounting opening is provided;
a packing member sealing the assembly mounting opening in a state in which the wiring unit projects out from the opening of the exterior packaging bag and being installed on the assembly mounting opening of the case body; and
a connector connected to the wiring unit inside the case body and to an electrical circuit.