Method for mounting a three-axis MEMS device with precise orientation
This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically.
1. A method of integrating a three-dimensional micro-electro-mechanical system (MEMS) sensing device at precise angles on a substrate having a surface oriented in an xy-plane, the method comprising:
coating bond pads arrayed on at least one of opposing longitudinal sides of a z-axis sensing device with an electrically-conductive material using a first mask with openings;
completely covering the electrically-conductive material on the bond pads in all dimensions with a solder material using a second mask, wherein the second mask has openings that are larger than the openings in the first mask;
providing a bonding pattern for the z-axis sensing device on some portion of the substrate;
mechanically and electrically coupling the solder material on corresponding bonding areas of the bonding pattern provided on the substrate; and
electrically coupling and mechanically coupling a two-axis (xy-) sensing device to the surface of the substrate.
2. The method as recited in claim 1 , wherein coating bond pads arrayed on opposing longitudinal sides of the z-axis sensing includes using electrically-conductive material selected from the group consisting of copper, silver, gold, platinum, and alloys and combinations thereof.
3. The method as recited in claim 1 , wherein the solder material is selected from the group consisting of tin and tin alloys.
4. The method as recited in claim 1 , wherein attaching the two-dimensional sensing device to the substrate includes mechanically coupling said two-dimensional sensing device to an upper surface of an integrated circuit device and mechanically and electrically coupling the integrated circuit device to the substrate.
5. The method as recited in claim 4 , wherein the integrated circuit device is attached to the substrate using flip chip methods.
6. The method as recited in claim 1 further comprising:
mold injecting the substrate; and
dice-cutting the substrate.
7. The method as recited in claim 1 , wherein the second mask is structured and arranged to cover the electrically-conductive material completely.
8. The method as recited in claim 1 , wherein the electrically-conductive material is applied to have a thickness of approximately 100 micrometers.
9. The method as recited in claim 1 , wherein the solder material is applied to have a thickness of approximately 50 micrometers.
10. The method as recited in claim 1 , wherein providing a bonding pattern includes at least one of screen printing a pattern and dispensing a pattern on the substrate.
11. The method as recited in claim 10 , wherein the at least one of screen printing a pattern and dispensing a pattern includes using a material selected from the group consisting of a flux material, a solder paste, an under-fill material, and combinations thereof.
12. The method as recited in claim 1 , wherein mechanically and electrically coupling the solder material on corresponding portions of the bonding pattern disposed on the substrate includes reflow techniques.