Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof

1. A composition comprising:

a. from 35 to 80 vol % of a thermoplastic polymer;

b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK;

c. from 2 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK and

d. from 2 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by:

i. a thermal conductivity of at least 1.0 W/mK;

ii. a volume resistivity of at least 10 7 Ohm.cm.

2. The composition of claim 1 , wherein the thermoplastic polymer comprises a polyamide, polyester, polyethylene and ethylene based copolymer, polypropylene, polyphenylene sulfide, polyetheretherketone, polycarbonate, polyetherimide, or a combination thereof.

3. The composition of claim 1 , wherein the thermoplastic polymer comprises a polyamide, polyester, polyethylene and ethylene based copolymer, polypropylene, polyphenylene sulfide, or a combination thereof.

4. The composition of claim 1 , wherein the low thermally conductive filler comprises ZnS, CaO, MgO, ZnO, TiO 2 , or a combination thereof.

5. The composition of claim 1 , wherein the low thermally conductive filler comprises ZnS, TiO 2 , MgO, or a combination thereof.

6. The composition of claim 1 , wherein the high thermally conductive, electrically insulative filler comprises AlN, BN, MgSiN 2 , SiC, ceramic-coated graphite, or a combination thereof.

7. The composition of claim 1 , wherein the high thermally conductive, electrically insulative filler comprises boron nitride, silicon carbide, or a combination thereof.

8. The composition of claim 1 , wherein the high thermally conductive, electrically conductive filler comprises graphite, expanded graphite, graphene, a carbon fiber, a carbon nanotube, graphitized carbon black, or a combination thereof.

9. The composition of claim 1 , wherein the high thermally conductive, electrically conductive filler comprises graphite, expanded graphite, or a combination thereof.

10. The composition of claim 1 , wherein the thermoplastic polymer comprises a polyamide, polyester, polyethylene and ethylene based copolymer, polypropylene, polyphenylene sulfide, or a combination thereof; the low thermally conductive filler comprises, ZnS, TiO 2 , MgO, or a combination thereof; the high thermally conductive, electrically insulative filler comprises boron nitride; and the high thermally conductive, electrically conductive filler comprises graphite.

11. An article formed from the composition of claim 1 .

12. The article of claim 11 , wherein the article is a molded article.

13. A method of using a thermoplastic polymer composition in a high thermal conductivity application comprising contacting the thermoplastic polymer composition of claim 1 with an elevated external temperature, wherein the thermoplastic polymer composition is used in an application requiring the composition to have (1) a thermal conductivity of at least 1.0 W/mK, and (2) a volume resistivity of at least 10 7 Ohm.cm.

14. The method of claim 13 , wherein the polymer composition is in the form of an article.

15. The method of claim 14 , wherein the article is a molded article.