IP Library Granted Patent US 8,739,855
Granted Patent B2
US 8,739,855 · App. 13/402,966 · Granted Jun 3, 2014

Microchannel heat exchanger

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Quick Facts
Patent No.
US 8,739,855
App. No.
13/402,966
Granted
Jun 3, 2014
Kind
B2
Abstract

A heat exchanger includes an inlet header configured to receive a cooling fluid and an outlet header configured to discharge the cooling fluid. A plurality of microchannel tubes are in fluid communication with and extend between the inlet header and the outlet header. The microchannel tubes define a first heat exchanger region and a second heat exchanger region between the inlet header and the outlet header. The first heat exchanger region has a plurality of fins defining a first fin density that is greater than a second fin density of the second heat exchanger region.

Claims (14)

1. A cooling system comprising:

a first flue and a second flue cooperatively defining an air passageway;

a fan disposed in the air passageway to generate an airflow through the first and second flue; and

an evaporator in communication with at least one of the first flue and the second flue for cooling the airflow, the evaporator comprising

an inlet header configured to receive a cooling fluid;

an outlet header configured to discharge the cooling fluid; and

a plurality of microchannel tubes in fluid communication with and extending between the inlet header and the outlet header, the microchannel tubes defining a first side of the heat exchanger between the inlet header and the outlet header and an opposed second side of the heat exchanger between the inlet header and the outlet header, wherein the first and second flue define a bend in the air passageway, and further wherein the evaporator is positioned at the bend such that the airflow passes from the first side to the second side in a first direction and then passes from the second side to the first side in a second direction different from the first direction.

2. The system of claim 1 , wherein the evaporator is defined by a first heat exchanger region that extends from one of the outlet header and the inlet header to a point between the inlet header and the outlet header and a second heat exchanger region that extends from the other of the outlet header and the inlet header to the point.

3. The system of claim 2 , wherein the first heat exchanger region has a plurality of fins defining a first density and the second heat exchanger region has a plurality of fins defining a second fin density that is different from the first fin density.

4. The system of claim 3 , wherein the second fin density is less than the first fin density.

5. The system of claim 3 , wherein the first fin density is between about 3 fins per inch and about 24 fins per inch.

6. The system of claim 2 , wherein the first heat exchanger region has a plurality of fins and the second heat exchanger region is devoid of fins.

7. The system of claim 2 , wherein the evaporator is disposed within the air passageway such that the airflow generated by the fan passes through the first heat exchanger region only after passing through the second heat exchanger region.

8. The system of claim 1 , wherein the plurality of microchannel tubes extends linearly between the inlet header and the outlet header.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 027091, FRAME 0111 AND REEL 029568, FRAME 0286 Recorded Apr 1, 2016
From: GENERAL ELECTRIC COMPANY (AS SUCCESSOR IN INTEREST BY MERGER TO GENERAL ELECTRIC CAPITAL CORPORATION), AS ADMINISTRATIVE AGENT
To: HUSSMANN CORPORATION
Reel/Frame 038329/0685 →
NOTICE AND CONFIRMATION OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jan 3, 2013
From: HUSSMANN CORPORATION
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 029568/0286 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2012
From: FRITZ, STEVE L.; DEKAM, MATTHEW J.
To: HUSSMANN CORPORATION
Reel/Frame 027990/0030 →