Electronic device and method of radiating heat from electronic device
View Patent ↗An electronic device including a housing including a frame member exposed to an outer surface of the electronic device; a circuit substrate disposed within the housing on which a plurality of electronic components are disposed; and a heat-radiating member provided in contact with or in close proximity to the electronic components disposed on the circuit substrate, and in contact with the frame member.
1. An electronic device comprising:
a housing including a frame member exposed to an outer surface of the electronic device;
a circuit substrate disposed within the housing on which a plurality of electronic components are disposed; and
a heat-radiating member provided in contact with or in close proximity to the electronic components disposed on the circuit substrate, and in contact with the frame member, wherein
the heat-radiating member includes
a heat-absorbing plate having a continuous top surface that extends beyond the electronic components disposed on the circuit substrate; and
a reinforcing plate having a continuous top surface that is in direct contact with, and extends beyond an outer periphery of, a continuous bottom surface of the heat-absorbing plate and a continuous bottom surface that is in direct contact with the frame member.
2. The electronic device of claim 1 , wherein the heat-radiating member is in contact with the electronic components disposed on the circuit substrate.
3. The electronic device of claim 1 , wherein the heat-radiating member is in close proximity to the electronic components disposed on the circuit substrate.
4. The electronic device of claim 1 , wherein the heat-radiating member is formed of a high-conductivity material with high heat conductivity.
5. The electronic device of claim 1 , wherein the frame member extends along an outer periphery of the housing.
6. The electronic device of claim 1 , further comprising:
an upper housing and a lower housing disposed in contact with the frame member.
7. The electronic device of claim 1 , wherein the heat-radiating member includes projections having shapes and volumes respectively corresponding to shapes and volumes of void portions formed between the electronic components and the heat-radiating member and between the circuit substrate and the heat-radiating member when the heat-radiating member is disposed to face the circuit substrate.
8. The electronic device of claim 7 , wherein the projections are fitted with the void portions formed between the electronic components and the heat-radiating member and between the circuit substrate and the heat-radiating member when the heat-radiating member is disposed to face the circuit substrate.
9. The electronic device of claim 1 , wherein the frame member includes one or a plurality of grooves formed on an outer surface facing the outer surface of the electronic device.
10. The electronic device of claim 1 , wherein the frame member formed of aluminum.
11. The electronic device of claim 1 , wherein the heat-radiating member is a copper plate or a silver plate.
12. A method of radiating heat from an electronic device comprising:
disposing a heat-radiating member in contact, or in close proximity, to electronic components on a circuit substrate disposed within a housing of the electronic device, and in contact with a frame member of the housing exposed to an outer surface of the electronic device, wherein
the heat-radiating member includes
a heat-absorbing plate having a continuous top surface that extends be and the electronic components disposed on the circuit substrate; and
a reinforcing plate having a continuous top surface that is in direct contact with, and extends beyond an outer periphery of, a continuous bottom surface of the heat-absorbing plate and a continuous bottom surface that is in direct contact with the frame member.
13. The method of claim 12 , wherein the heat-radiating member includes projections having shapes and volumes respectively corresponding to shapes and volumes of void portions formed between the electronic components and the heat-radiating member and between the circuit substrate and the heat-radiating member when the heat-radiating member is disposed to face the circuit substrate.
14. The method of claim 13 , wherein the projections are fitted with the void portions formed between the electronic components and the heat-radiating member and between the circuit substrate and the heat-radiating member when the heat-radiating member is disposed to face the circuit substrate.