IP Library Granted Patent US 8,543,967
Granted Patent B2
US 8,543,967 · App. 13/405,059 · Granted Sep 24, 2013

Computer system and method for determining a temperature rise in direct current (DC) lines caused by joule heating of nearby alternating current (AC) lines

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,543,967
App. No.
13/405,059
Granted
Sep 24, 2013
Kind
B2
Abstract

A computer system performs a verification process that quickly and efficiently determines a temperature rise of DC conductor lines of an IC design caused by Joule heating in nearby AC conductor lines of the IC design, and whether the temperature rise is acceptable in terms of an electromigration performance of the IC design.

Claims (69)

1. A computer system for analyzing an integrated circuit (IC) design to determine whether a temperature rise caused by Joule heating in alternating current (AC) conductor lines is acceptable, the system comprising:

a user interface;

a memory subsystem that stores a representation of at least a portion of the IC design and computer code for performing a verification analysis; and

a processor subsystem, the processor subsystem programmed to:

select a characteristic finite area in said representation, the selected characteristic finite area corresponding to an area having a particular shape and size and having a particular direct current (DC) conductor line configuration that is repeated throughout said representation;

compute a characteristic function for the selected characteristic finite area, the characteristic function characterizing a temperature rise of the selected characteristic finite area as a function of Joule heating power produced by an alternating current (AC) conductor line configuration of the selected characteristic finite area;

for each actual finite area in said representation that has a size and shape and a DC conductor line configuration that matches the size and shape and DC conductor line configuration of the selected characteristic finite area:

calculate a total Joule heating power of the AC conductor line configuration of the actual finite area,

apply the respective total Joule heating power of each respective actual finite area to said characteristic function to calculate a respective temperature rise value for each respective actual finite area, and

compare each respective temperature rise value with a predetermined threshold (TH) value to determine whether the respective temperature rise value exceeds the TH value.

2. The computer system of claim 1 , wherein if the respective temperature rise value of a respective actual finite area exceeds the TH value, the respective actual finite area is tagged as failing the verification analysis.

3. The computer system of claim 1 , wherein if the respective temperature rise value of a respective actual finite area does not exceed the TH value, the respective actual finite area is tagged as passing the verification analysis.

4. The computer system of claim 1 , wherein if the respective temperature rise value of a respective actual finite area exceeds the TH value, the respective actual finite area is deemed to have failed the verification analysis.

5. The computer system of claim 1 , wherein if the respective temperature rise value of a respective actual finite area exceeds the TH value, the respective actual finite area is further analyzed in a subsequent verification process that more accurately determines the Joule heating power and the temperature rise value of the respective AC conductor configuration and determines whether the more accurately determined temperature rise value exceeds the TH value.

6. The computer system of claim 1 , wherein if the respective temperature rise value of a respective actual finite area exceeds the TH value, then the respective actual finite area is deemed a failed actual finite area and a subsequent verification process is performed that obtains an adjusted temperature rise value for the failed actual finite area based on an analysis of sharing of Joule power heating densities among the failed actual finite area and neighboring actual finite areas that border the failed actual finite area and compares the adjusted temperature rise value with the TH value to determine whether the adjusted temperature rise value exceeds the TH value.

7. The computer system of claim 1 , further comprises:

a user input device connected to the user interface, wherein the selected characteristic finite area is selected at least partly based on a user input that is inputted into the computer system via the user input device.

8. The computer system of claim 1 , wherein the computer system further comprises:

a display device connected to the user interface, and wherein the determination of whether the respective temperature rise value exceeds the TH value is displayed on the display device.

9. The computer system of claim 1 , wherein the characteristic function is a linear function.

10. The computer system of claim 1 , wherein the characteristic function is a nonlinear function.

11. The computer system of claim 9 , wherein the linear function is a scalar.

12. A method for analyzing an integrated circuit (IC) design in a computer system to determine whether a temperature rise caused by Joule heating in alternating current (AC) conductor lines is acceptable, the method comprising:

in a memory subsystem of the computer system, storing a representation of at least a portion of the IC design and computer code for performing a verification analysis; and

in a processor subsystem of the computer system:

selecting a characteristic finite area in said representation, the selected characteristic finite area corresponding to an area having a particular shape and size and having a particular direct current (DC) line conductor configuration that is repeated throughout said representation;

computing a characteristic function for the selected characteristic finite area, the characteristic function characterizing a temperature rise of the selected characteristic finite area as a function of Joule heating power produced by an alternating current (AC) conductor line configuration of the selected characteristic finite area;

for each actual finite area in said representation that has a size and shape and a DC conductor line configuration that matches the size and shape and DC conductor line structure of the selected characteristic finite area:

calculating a total Joule heating power of the AC conductor line configuration of the actual finite area,

applying the respective total Joule heating power of the respective actual finite area to said characteristic function to calculate a respective temperature rise value for the respective actual finite area, and

comparing the respective temperature rise value with a predetermined threshold (TH) value to determine whether the respective temperature rise value exceeds the TH value.

13. The method of claim 12 , further comprising:

if the respective temperature rise value of a respective actual finite area exceeds the TH value, tagging the respective actual finite area as failing the verification analysis.

14. The method of claim 12 , further comprising:

if the respective temperature rise value of a respective actual finite area does not exceed the TH value, tagging the respective actual finite area as passing the verification analysis.

15. The method of claim 12 , wherein if the respective temperature rise value of a respective actual finite area exceeds the TH value, the respective actual finite area is deemed to have failed the verification analysis.

16. The method of claim 12 , further comprising:

if the respective temperature rise value of a respective actual finite area exceeds the TH value, further analyzing the respective actual finite area in a subsequent verification process that more accurately determines the Joule heating power and the temperature rise value of the respective AC conductor line configuration to determine whether the more accurately determined temperature rise value exceeds the TH value.

17. The method of claim 12 , further comprising:

if the respective temperature rise value of a respective actual finite area exceeds the TH value, then the respective actual finite area is deemed a failed actual finite area and the respective failed actual finite area is further analyzed in a subsequent verification process that obtains an adjusted temperature rise value for the failed actual finite area based on an analysis of sharing of Joule power heating densities among the failed actual finite area and neighboring actual finite areas that border the failed actual finite area and compares the adjusted temperature rise value with the TH value to determine whether the adjusted temperature rise value exceeds the TH value.

18. The method of claim 12 , further comprising:

with a user input device connected to a user interface of the computer system, entering a user input to the computer system, wherein the selected characteristic finite area is selected at least partly based on the user input.

19. The method of claim 12 , wherein the computer system further comprises:

on a display device connected to a user interface of the computer system, displaying the determination of whether the respective temperature rise value exceeds the TH value.

20. The method of claim 12 , wherein the characteristic function is a linear function.

21. The method of claim 12 , wherein the characteristic function is a nonlinear function.

22. The method of claim 20 , wherein the linear function is a scalar.

23. A computer program for analyzing an integrated circuit (IC) design in a computer system to determine whether a temperature rise caused by Joule heating in alternating current (AC) conductor lines of the IC design is acceptable, the computer program comprising computer instructions stored on a non-transitory computer-usable medium, the computer instructions comprising:

computer instructions for selecting a characteristic finite area in a representation of at least a portion of the IC design to be used as a characteristic finite area in a verification analysis, the selected characteristic finite area corresponding to an area having a particular shape and size and having a particular direct current (DC) conductor line configuration that is repeated throughout said representation;

computer instructions for computing a characteristic function for the selected characteristic finite area, the characteristic function characterizing a temperature rise of the selected characteristic finite area as a function of Joule heating power produced by an alternating current (AC) conductor line configuration of the selected characteristic finite area;

computer instructions for analyzing each actual finite area in said representation that has a size and shape and a DC conductor line configuration that matches the size and shape and DC conductor line configuration of the selected characteristic finite area by:

calculating a total Joule heating power of the AC conductor line configuration of the actual finite area,

applying the respective total Joule heating power of the respective actual finite area to said characteristic function to calculate a respective temperature rise value for the respective actual finite area, and

comparing the respective temperature rise value with a predetermined threshold (TH) value to determine whether the respective temperature rise value exceeds the TH value.

24. The computer program of claim 23 , further comprising:

computer instructions for tagging the respective actual finite area as failing the verification analysis if the respective temperature rise value of the respective actual finite area exceeds the TH value.

25. The computer program of claim 23 , further comprising:

computer instructions for tagging the respective actual finite area as passing the verification analysis if the respective temperature rise value of the respective actual finite area does not exceed the TH value.

26. The computer program of claim 23 , further comprising:

computer instructions for further analyzing the respective actual finite area in a subsequent verification process if the respective temperature rise value of the respective actual finite area exceeds the TH value, wherein the subsequent verification process more accurately determines the Joule heating power and the temperature rise value of the respective AC conductor line configuration of the respective actual finite area to determine whether the more accurately determined temperature rise value exceeds the TH value.

27. The computer program of claim 23 , further comprising:

computer instructions for further analyzing the respective actual finite area in a subsequent verification process if the respective temperature rise value of the respective actual finite area exceeds the TH value, wherein if the respective temperature rise value of the respective actual finite area exceeds the TH value, the respective actual finite area is deemed a failed actual finite area, and wherein the subsequent verification process obtains an adjusted temperature rise value for the failed actual finite area based on an analysis of sharing of Joule power heating densities among the failed actual finite area and neighboring actual finite areas that border the failed actual finite area and compares the adjusted temperature rise value with the TH value to determine whether the adjusted temperature rise value exceeds the TH value.

28. The computer program of claim 23 , further comprising:

computer instructions for processing a user input that has been inputted into the computer system via a user input device connected to a user interface of the computer system, wherein the selected characteristic finite area is selected at least partly based on the user input.

29. The computer program of claim 23 , further comprising:

computer instructions for causing the determination of whether the respective temperature rise value exceeds the TH value to be displayed on a display device connected to a user interface of the computer system.

30. The computer program of claim 23 , wherein the characteristic function is a linear function.

31. The computer program of claim 23 , wherein the characteristic function is a nonlinear function.

32. The computer program of claim 30 , wherein the linear function is a scalar.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →