Liquid crystal display device with grounded by thermocompression bonding tape and double-side adhesive tape
View Patent ↗A liquid crystal display device which can be manufactured at a low cost is provided. The liquid crystal display device includes a TFT substrate, a CF substrate of a size smaller than a size of the TFT substrate, and a liquid crystal layer sandwiched between the TFT substrate and the CF substrate. A ground pad is formed on a portion of the TFT substrate where the CF substrate does not overlap with the TFT substrate. A transparent conductive film is formed on an upper surface of the CF substrate. The transparent conductive film of the CF substrate and the ground pad formed on the TFT substrate are electrically connected with each other via a thermocompression bonding conductive tape. A double-sided adhesive tape is arranged between the thermocompression bonding conductive tape and an upper surface of the CF substrate and between the thermocompression bonding conductive tape and the TFT substrate.
1. A liquid crystal display device having an IPS-method liquid crystal display panel, wherein
the liquid crystal display panel is formed of a pair of substrates consisting of one large substrate and one small substrate and a liquid crystal layer sandwiched between the pair of substrates,
a transparent conductive film is formed on a surface of the small substrate of the liquid crystal display panel on a side opposite to a surface of the small substrate on which the liquid crystal layer is arranged,
a ground pad is arranged on a region of the large substrate of the liquid crystal display panel where the large substrate does not overlap with the small substrate, and
the transparent conductive film and the ground pad are connected with each other using a thermocompression bonding conductive tape, and a double-sided adhesive tape is arranged between, the thermocompression bonding conductive tape and the large substrate or between the thermocompression bonding conductive tape and the small substrate.
2. A liquid crystal display device according to claim 1 , wherein the double-sided adhesive tape is arranged along one side of the thermocompression bonding conductive tape.
3. A liquid crystal display device according to claim 1 , wherein the double-sided adhesive tape is arranged along two opposing sides of the thermocompression bonding conductive tape.
4. A liquid crystal display device having an IPS-method liquid crystal display panel, wherein
the liquid crystal display panel is formed of a pair of substrates consisting of one large substrate and one small substrate and a liquid crystal layer sandwiched between the pair of substrates,
a transparent conductive film is formed on a surface of the small substrate of the liquid crystal display panel on a side opposite to a surface of the small substrate on which the liquid crystal layer is arranged,
a ground pad is arranged on a region of the large substrate of the liquid crystal display panel where the large substrate does not overlap with the small substrate, and
the transparent conductive film and the ground pad are connected with each other using a thermocompression bonding conductive tape, and a double-sided adhesive tape is continuously arranged between the thermocompression bonding conductive tape and the large substrate and between the thermocompression bonding conductive tape and the small substrate.
5. A liquid crystal display device according to claim 4 , wherein the double-sided adhesive tape is continuously arranged over a region ranging from an upper surface of the small substrate to the large substrate.
6. A liquid crystal display device according to claim 1 , wherein the double-sided adhesive tape is continuously arranged over a region ranging from the upper surface of the small substrate to the large substrate along one side of the thermocompression bonding conductive tape.
7. A liquid crystal display device according to claim 5 , wherein the double-sided adhesive tape is continuously arranged over a region ranging from the upper surface of the small substrate to the large substrate along two opposing sides of the thermocompression bonding conductive tape.