Peeling apparatus and manufacturing apparatus of semiconductor device
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
1. A peeling method comprising:
attaching a film to an element formation layer over a substrate by a first roller;
moving the film by a second roller;
inserting the substrate in a liquid in a tank at an oblique angle to a top surface of the liquid; and
peeling the element formation layer from the substrate in the liquid in the tank, so that the element formation layer is transferred to the film.
2. The peeling method according to claim 1 , wherein the peeling is generated between the element formation layer and a peeling layer which is formed over the substrate.
3. The peeling method according to claim 1 , further comprising a step of spraying dried air from a nozzle to the film to which the element formation layer is transferred.
4. The peeling method according to claim 1 , wherein the substrate is dropped into the liquid after the element formation layer is transferred to the film.
5. The peeling method according to claim 1 , wherein the film is bent along a curved surface of the second roller.
6. A peeling method comprising:
supplying a film by a supplying roller;
attaching the film to an element formation layer over a substrate by a first roller;
moving the film by a second roller;
inserting the substrate in a liquid in a tank at an oblique angle to a top surface of the liquid;
pulling the film obliquely upward from the substrate by a collecting roller; and
peeling the element formation layer from the substrate in the liquid in the tank, so that the element formation layer is transferred to the film.
7. The peeling method according to claim 6 , wherein the peeling is generated between the element formation layer and a peeling layer which is formed over the substrate.
8. The peeling method according to claim 6 , further comprising a step of spraying dried air from a nozzle to the film to which the element formation layer is transferred.
9. The peeling method according to claim 6 , wherein the substrate is dropped into the liquid after the element formation layer is transferred to the film.
10. The peeling method according to claim 6 , wherein the film is bent along a curved surface of the second roller.
11. A peeling method comprising:
moving a substrate on which an element formation layer is formed by a first belt conveyor;
attaching a film to the element formation layer by a first roller;
moving the film by a second roller;
moving the substrate by a second belt conveyor, a portion of the second belt conveyor being in a liquid in a tank;
inserting the substrate in a liquid in a tank at an oblique angle to a top surface of the liquid; and
peeling the element formation layer from the substrate in the liquid in the tank, so that the element formation layer is transferred to the film.
12. The peeling method according to claim 11 , wherein the peeling is generated between the element formation layer and a peeling layer which is formed over the substrate.
13. The peeling method according to claim 11 , further comprising a step of spraying dried air from a nozzle to the film to which the element formation layer is transferred.
14. The peeling method according to claim 11 , wherein the substrate is dropped into the liquid after the element formation layer is transferred to the film.
15. The peeling method according to claim 11 , wherein the film is bent along a curved surface of the second roller.
16. The peeling method according to claim 11 , wherein the element formation layer is peeled from the substrate between the second roller and the second belt conveyor.
17. A peeling method comprising:
moving a substrate on which an element formation layer is formed by a first belt conveyor;
supplying a film by a supplying roller;
attaching the film to the element formation layer by a first roller;
moving the film by a second roller;
moving the substrate by a second belt conveyor, a portion of the second belt conveyor being in a liquid in a tank;
inserting the substrate in a liquid in a tank at an oblique angle to a top surface of the liquid;
pulling the film obliquely upward from the substrate by a collecting roller; and
peeling the element formation layer from the substrate in the liquid in the tank, so that the element formation layer is transferred to the film.
18. The peeling method according to claim 17 , wherein the peeling is generated between the element formation layer and a peeling layer which is formed over the substrate.
19. The peeling method according to claim 17 , further comprising a step of spraying dried air from a nozzle to the film to which the element formation layer is transferred.
20. The peeling method according to claim 17 , wherein the substrate is dropped into the liquid after the element formation layer is transferred to the film.
21. The peeling method according to claim 17 , wherein the film is bent along a curved surface of the second roller.
22. The peeling method according to claim 17 , wherein the element formation layer is peeled from the substrate between the second roller and the second belt conveyor.