IP Library Granted Patent US 8,836,668
Granted Patent B2
US 8,836,668 · App. 13/406,658 · Granted Sep 16, 2014

Transparent touch-responsive capacitor with variable-height micro-wires

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Quick Facts
Patent No.
US 8,836,668
App. No.
13/406,658
Granted
Sep 16, 2014
Kind
B2
Abstract

A touch-responsive capacitive apparatus includes a transparent substrate having first and second pad and interstitial areas. Pairs of first and second pad areas define corresponding touch-responsive capacitors. Electrically connected first pad micro-wires are formed in the first pad areas and electrically connected first interstitial micro-wires are formed in the first interstitial areas. The first pad micro-wires are electrically connected to the first interstitial wires. Electrically connected second pad micro-wires are formed in the second pad areas and electrically connected second interstitial micro-wires are formed in the second interstitial areas. The second pad micro-wires are electrically connected to the second interstitial wires. The height of at least a portion of the first interstitial micro-wires is greater than the height of at least a portion of the first pad micro-wires.

Claims (28)

1. A touch-responsive capacitive apparatus, comprising:

a transparent substrate;

a plurality of electrically connected first pad micro-wires formed in a plurality of first pad areas in a first micro-wire layer and a plurality of electrically connected first interstitial micro-wires formed in a plurality of first interstitial areas in the first micro-wire layer, the first pad micro-wires electrically connected to the first interstitial micro-wires;

a plurality of electrically connected second pad micro-wires formed in a plurality of second pad areas in a second micro-wire layer and a plurality of electrically connected second interstitial micro-wires formed in a plurality of second interstitial areas in the second micro-wire layer, the second pad micro-wires electrically connected to the second interstitial micro-wires; and

wherein pairs of first and second pad areas define corresponding touch-responsive capacitors, the transparent substrate supports the first or second micro-wire layers, and the height of at least a portion of the first interstitial micro-wires is greater than the height of at least a portion of the first pad micro-wires and wherein the width of the first interstitial micro-wires is the same as the width of the first pad micro-wires.

2. The touch-responsive capacitive apparatus according to claim 1 , wherein the height of at least a portion of the second interstitial micro-wires is greater than the height of at least a portion of the second pad micro-wires.

3. The touch-responsive capacitive apparatus according to claim 1 , further including a dielectric layer having a first side adjacent the first micro-wire layer and a second side opposite the first side adjacent the second micro-wire layer.

4. The touch-responsive capacitive apparatus according to claim 3 , wherein the transparent substrate provides the dielectric layer or the dielectric layer is separate from the transparent substrate.

5. The touch-responsive capacitive apparatus according to claim 1 , wherein the transparent substrate has a first side and a second side opposed to the first side, and wherein the first micro-wire layer is formed on the first side and the second micro-wire layer is formed on the second side.

6. The touch-responsive capacitive apparatus according to claim 1 , wherein the width of the second interstitial micro-wires is the same as the width of the second pad micro-wires.

7. Touch-responsive capacitor apparatus, comprising:

a transparent substrate having first and second sides;

a plurality of first pad micro-wires formed in a plurality of spaced-apart first pad areas in a first micro-wire layer over or on the first side and a plurality of first interstitial micro-wires formed in a plurality of spaced-apart first interstitial areas spaced apart from the first pad areas in the first micro-wire layer, the first interstitial micro-wires electrically connected to the first pad micro-wires;

a plurality of second pad micro-wires formed in a plurality of spaced-apart second pad areas in a second micro-wire layer under or on the second side and a plurality of second interstitial micro-wires formed in a plurality of spaced-apart second interstitial areas in the second micro-wire layer, the second interstitial micro-wires electrically connected to the second pad micro-wires;

a dielectric layer located between the first and second micro-wire layers; and

wherein the first and second pad areas define corresponding touch-responsive capacitors whose capacitance changes in response to a touch, and the height of the first interstitial micro-wires is greater than the height of the first pad micro-wires or the height of at least a portion of the second interstitial micro-wires is greater than the height of at least a portion of the second pad micro-wires.

8. The touch-responsive capacitive apparatus according to claim 7 , wherein the width of the first interstitial micro-wires is the same as the width of the first pad micro-wires.

9. The touch-responsive capacitive apparatus according to claim 7 , wherein one or more first pad micro-wires in a first pad area is electrically connected to one or more first pad micro-wires in a different first pad area by one or more first interstitial micro-wires.

10. The touch-responsive capacitive apparatus according to claim 7 , wherein the transparent substrate has a surface and a first pad area is adjacent to a second pad area in a direction parallel to the surface.

11. The touch-responsive capacitive apparatus according to claim 7 , wherein the transparent substrate has a surface and a first pad area is adjacent to a second pad area in a direction orthogonal to the surface.

12. The touch-responsive capacitive apparatus according to claim 7 , wherein the first micro-wire layer is formed on a first transparent substrate and the second micro-wire layer is formed on a second transparent substrate different from the first transparent substrate.

13. The touch-responsive capacitor apparatus according to claim 7 , wherein the transparent substrate provides the dielectric layer or the dielectric layer is separate from the transparent substrate.

14. The touch-responsive capacitor apparatus according to claim 7 , wherein the first pad micro-wires are made of a different material than the first interstitial micro-wires.

15. The touch-responsive capacitor apparatus of claim 7 , wherein one or more of the first interstitial micro-wires has a different height from one or more other first interstitial micro-wires.

16. The touch-responsive capacitive apparatus according to claim 7 , wherein the transparent substrate has a first side and a second side opposed to the first side, and wherein the first micro-wire layer is formed on the first side and the second micro-wire layer is formed on the second side.

17. The touch-responsive capacitive apparatus according to claim 7 , wherein the width of the second interstitial micro-wires is the same as the width of the second pad micro-wires.

18. The touch-responsive capacitive apparatus according to claim 7 , wherein the first or second pad or interstitial micro-wires are a metal, a metal alloy, or include cured or sintered metal particles.

19. The touch-responsive capacitive apparatus according to claim 18 , wherein the metal is nickel, tungsten, silver, gold, titanium, or tin or includes nickel, tungsten, silver, gold, titanium, or tin.

Assignments (13)
NOTICE OF SECURITY INTERESTS Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 056984/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0233 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056733/0681 →
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
PATENT SECURITY AGREEMENT Recorded Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2012
From: COK, RONALD STEVEN
To: EASTMAN KODAK COMPANY
Reel/Frame 027772/0439 →