Making micro-wires with different heights
View Patent ↗A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent conductor precursor structure including a transparent substrate, a first precursor material layer formed over the transparent substrate and a second precursor material layer formed on the first precursor material layer; forming a electrically connected first micro-wires in the first and second precursor material layers; forming electrically connected second micro-wires in a precursor material layer electrically connected to the first micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires, and wherein the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.
1. A method of making a transparent conductor structure, comprising:
providing a transparent conductor precursor structure including a transparent substrate, a first precursor material layer formed over the transparent substrate and a second precursor material layer formed on the first precursor material layer;
forming within a first transparent conductor area a plurality of electrically connected first micro-wires in the first and second precursor material layers;
forming within a second transparent conductor area a plurality of electrically connected second micro-wires in either the first precursor material layer or the second precursor material layer, the second micro-wires electrically connected to the first micro-wires;
wherein the first and second transparent conductor areas are non-overlapping areas over the transparent substrate; and
wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires, and wherein the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.
2. The method according to claim 1 , further including:
forming the first and second precursor material layers by forming first and second photo-sensitive layers of spectrally photo-sensitive precursor material on the transparent substrate, the first photo-sensitive layer sensitive to a first spectrum and the second photo-sensitive layer sensitive to a second spectrum different from the first spectrum.
3. The method according to claim 2 , wherein the first photo-sensitive layer includes a first spectrally-sensitive radiation-absorbing material and the second photo-sensitive layer includes a second spectrally-sensitive radiation-absorbing material different from the first spectrally-sensitive radiation-absorbing material.
4. The method according to claim 1 wherein the first precursor material layer is photosensitive to a first-spectrum light and the second precursor material layer is photosensitive to a second-spectrum light different from the first spectrum.
5. The method according to claim 4 wherein the first precursor material layer is also photosensitive to the second-spectrum light and the second precursor material layer is substantially insensitive to first-spectrum light.
6. The method according to claim 4 further comprising:
pattern-wise exposing the transparent precursor material structure in the first transparent conductor area to second-spectrum light, and optionally to first-spectrum light, defining the plurality of electrically connected first micro-wires;
pattern-wise exposing the transparent conductive precursor structure in the second transparent conductor area to first-spectrum light defining the plurality of electrically connected second micro-wires; and
processing the exposed transparent conductive precursor structure thereby forming the plurality first and second micro-wires.
7. The method according to claim 6 wherein the first and second precursor material layers each include a photosensitive precursor material provided in a binder material.
8. The method according to claim 7 wherein the photosensitive precursor material includes silver halide and the binder material is gelatin.
9. The method according to claim 6 wherein the first and second precursor material layers each include a metallic particulate material or a metallic precursor material, and a photosensitive binder material.
10. The method according to claim 6 , further including curing the exposed portions of the first and second photo-sensitive layers and removing the uncured portions to form the first or second micro-wires.
11. The method according to claim 6 , further including curing the unexposed portions of the first and second photo-sensitive layers and removing the uncured portions to form the first or second micro-wires.
12. The method according to claim 2 , wherein the first and second photo-sensitive layers include conductive ink, conductive particles, or metal ink.
13. The method according to claim 1 wherein the transparent conductive structure includes a plurality of first and second transparent conductor areas.
14. The method according to claim 1 , further including forming the first micro-wires in a first step and forming the second micro-wires in a second step different from the first step.
15. The method according to claim 1 , further including forming the one or more first micro-wires and a portion of each of the one or more second micro-wires in a first step and forming the remainder of the one or more first micro-wires in a second step after the first step.
16. The method according to claim 15 , further including:
forming the first precursor material layer by pattern-wise depositing first precursor material in the first transparent conductor area and in the transparent conductor second area; and
forming the second precursor material layer by pattern-wise depositing second precursor material in the first area.
17. The method according to claim 1 , further including the pattern-wise transfer of precursor material from a source to the transparent substrate.
18. The method according to claim 1 , further including blanket-coating the transparent substrate with a material and pattern-wise exposing the blanket-coated material.
19. The method according to claim 1 , further including pattern-wise depositing material with an inkjet device or by transferring the material from a printing plate.
20. The method according to claim 1 , wherein the first or second materials are precursor materials and further including processing the precursor materials to become conductive materials.
21. The method according to claim 1 , further including providing the transparent substrate, forming the first precursor material layer over the transparent substrate and forming the second precursor material layer over the first precursor material layer.
22. A method of making a transparent conductor structure, comprising:
providing a transparent conductor precursor structure including a transparent substrate, a first precursor material layer formed over the transparent substrate and a second precursor material layer formed on the first precursor material layer;
forming within a first transparent conductor area a plurality of electrically connected first micro-wires in the first and second precursor material layers;
forming within a second transparent conductor area a plurality of electrically connected second micro-wires in either the first precursor material layer or the second precursor material layer, the second micro-wires electrically connected to the first micro-wires; and
wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires, and wherein the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area; and
further including:
forming the one or more first micro-wires and a portion of each of the one or more second micro-wires in a first step and forming the remainder of the one or more first micro-wires in a second step after the first step;
forming the first precursor material layer by depositing first precursor material in the first transparent conductor area and in the second transparent conductor area;
pattern-wise processing the first precursor material;
forming the second precursor material layer by depositing second precursor material in the first transparent conductor area; and
pattern-wise processing the second precursor material.
23. The method according to claim 22 , wherein the deposition includes blanket-coating the transparent substrate and further including pattern-wise exposing the blanket coating.
24. The method according to claim 23 , further including curing the pattern-wise exposed blanket coating.
25. A method of making a transparent conductor structure, comprising:
providing a transparent conductor precursor structure including a transparent substrate, a first precursor material layer formed over the transparent substrate and a second precursor material layer formed on the first precursor material layer;
forming within a first transparent conductor area a plurality of electrically connected first micro-wires in the first and second precursor material layers;
forming within a second transparent conductor area a plurality of electrically connected second micro-wires in either the first precursor material layer or the second precursor material layer, the second micro-wires electrically connected to the first micro-wires; and
wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires, wherein the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area, and wherein the first precursor material layer is photosensitive to a first-spectrum light and the second precursor material layer is photosensitive to a second-spectrum light different from the first spectrum; and
further comprising:
pattern-wise exposing the transparent precursor material structure in the first transparent conductor area to first-spectrum light and second-spectrum light, defining the plurality of electrically connected first micro-wires;
pattern-wise exposing the transparent conductive precursor structure in the second transparent conductor area to first- or second-spectrum light defining the plurality of electrically connected second micro-wires; and
processing the exposed transparent conductive precursor structure thereby forming the plurality first and second micro-wires.
26. The method according to claim 25 wherein the first and second precursor material layers each include a photosensitive precursor material provided in a binder material.