IP Library Granted Patent US 8,884,918
Granted Patent B2
US 8,884,918 · App. 13/406,845 · Granted Nov 11, 2014

Electronic device having metallic micro-wires

Inventors: Ronald Steven Cok (Rochester, NY); Terrence Robert O'Toole (Webster, NY)
Assignee: Eastman Kodak Company
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Quick Facts
Patent No.
US 8,884,918
App. No.
13/406,845
Granted
Nov 11, 2014
Kind
B2
Abstract

An electronic device includes a support having greater than 80% transmittance to light at 550 nm; and a transparent conductor area provided over at least a portion of one side of the support. The transparent conductor area includes: first metallic micro-wires provided in a first pattern, the first conductive micro-wires having a first height and a width in a range from 0.5 um to 20 um; second metallic micro-wires provided in a second pattern having a second height that is greater than the first height and a width in a range from 0.5 um to 20. The metallic micro-wires occupy an area less than 15% of the transparent conductor area.

Claims (38)

1. A conductive device, comprising:

a support having greater than 80% transmittance to light at 550 nm; and

a transparent conductor area provided over at least a portion of one side of the support, wherein the transparent conductor area includes:

first conductive metallic micro-wires provided in first locations in a first micro-pattern, the first conductive metallic micro-wires having a width in a range from 0.5 um to 20 um and a first height; and

second conductive metallic micro-wires provided in second locations different from the first locations in a second micro-pattern, wherein the height of the second conductive metallic micro-wires is less than the height of the first conductive metallic micro-wires, and the second metallic micro-wires have a width in a range from 0.5 um to 20 um, the second conductive metallic micro-wires in electrical contact with the first conductive metallic micro-wires; and

wherein the first and second metallic micro-wires occupy an area less than 15% of the transparent conductor area, the first conductive metallic micro-wires and the second conductive metallic micro-wires form a transparent electrode, and the second conductive metallic micro-wires in each second location are electrically connected to the second conductive metallic micro-wires of a different second location by the first conductive metallic micro- wires of the first locations.

2. The conductive device according to claim 1 wherein the first metallic micro-wires have a metallic bi-layer structure.

3. The conductive device according to claim 1 further including a plurality of transparent conductor areas, each forming a transparent electrode having a length and a width.

4. The conductive device according to claim 3 wherein the width of the transparent electrodes varies along the length of the transparent electrodes to form wide and narrow transparent electrode areas, and wherein the first metallic micro-wires are provided in wide transparent electrode areas and the second metallic micro-wires are provided in the narrow transparent electrode areas.

5. The conductive device according to claim 1 wherein the first micro-pattern is the same as the second micro-pattern.

6. The conductive device according to claim 1 wherein the first micro-pattern is different from the second micro-pattern.

7. The conductive device according to claim 1 wherein the second micro-wires have a lesser conductivity than the first micro-wires.

8. The conductive device according to claim 1 wherein the metallic micro-wires occupy an area less than or equal to 10% of the area of the transparent conductor area.

9. The conductive device according to claim 1 wherein the transparent conductor area has a transparency greater than 80% transmittance to light at 550 nm.

10. The conductive device according to claim 1 wherein the combined transparency of the support and the transparent conductor is greater than 80% in a wavelength range of 450 to 650 nm.

11. The conductive device according to claim 1 , wherein first conductive metallic micro-wires electrically connect second conductive metallic micro-wires provided in two different second locations.

12. Transparent conductor apparatus, comprising:

a transparent support having a plurality of first transparent conductor areas and a plurality of second transparent conductor areas different from the first transparent conductor area;

a plurality of electrically connected first micro-wires formed on the transparent substrate in a micro-wire layer in each of the first transparent conductor areas and a plurality of electrically connected second micro-wires formed on the transparent substrate in the micro-wire layer in each of the second transparent conductor areas electrically connected to the first micro-wires,

wherein the height of the first micro-wires is greater than the height of the second micro-wires, the first transparent conductor areas and the second transparent conductor areas form a transparent electrode, and the second micro-wires of each second transparent conductor area are electrically connected to the second micro-wires of a different second transparent conductor area by the first micro-wires of the first transparent conductor areas.

13. A conductive device, comprising:

a support having greater than 80% transmittance to light at 550 nm; and

a transparent conductor area provided over at least a portion of one side of the support, wherein the transparent conductor area includes:

first conductive metallic micro-wires provided in first locations in a first micro-pattern, the first conductive metallic micro-wires having a width in a range from 0.5 um to 20 um and a first height;

second conductive metallic micro-wires provided in second locations different from the first locations in a second micro-pattern, the second conductive metallic micro-wires having a second height that is less than the first height and a width in a range from 0.5 um to 20 um, the second conductive metallic micro-wires in electrical contact with the first conductive metallic micro-wires;

wherein the first and second metallic micro-wires occupy an area less than 15% of the transparent conductor area, the first conductive metallic micro-wires and the second conductive metallic micro-wires form a transparent electrode, and the second conductive metallic micro-wires in each second location are electrically connected to the second conductive metallic micro-wires of a different second location by the first conductive metallic micro-wires of the first locations; and

wherein the transparent conductor area includes at least first and second layers, and wherein the first metallic micro-wires are formed in the first layer and the second metallic micro-wires are formed in both the first and second layers.

14. The conductive device according to claim 13 wherein the first layer is closer to the support than the second layer.

15. The conductive device according to claim 13 wherein the second layer is closer to the support than the first layer.

16. The conductive device according to claim 13 wherein the first and second layers further include binder.

17. The conductive device according to claim 16 wherein the binder is gelatin and the first and second metallic micro-wires include silver.

18. A conductive device, comprising:

a support having greater than 80% transmittance to light at 550 nm; and

a transparent conductor area provided over at least a portion of one side of the support, wherein the transparent conductor area includes:

first conductive metallic micro-wires provided in first locations in a first micro-pattern, the first conductive metallic micro-wires having a width in a range from 0.5 um to 20 um and a first height;

second conductive metallic micro-wires provided in second locations different from the first locations in a second micro-pattern, the second conductive metallic micro-wires having a second height that is less than the first height and a width in a range from 0.5 um to 20 um, the second conductive metallic micro-wires in electrical contact with the first conductive metallic micro-wires;

wherein the first and second metallic micro-wires occupy an area less than 15% of the transparent conductor area, the first conductive metallic micro-wires and the second conductive metallic micro-wires form a transparent electrode, and the second conductive metallic micro-wires in each second location are electrically connected to the second conductive metallic micro-wires of a different second location by the first conductive metallic micro-wires of the first locations; and

wherein the second height is at least 30% less than the first height.

Assignments (13)
NOTICE OF SECURITY INTERESTS Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 056984/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0233 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056733/0681 →
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
PATENT SECURITY AGREEMENT Recorded Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2012
From: COK, RONALD STEVEN; O'TOOLE, TERRENCE ROBERT
To: EASTMAN KODAK COMPANY
Reel/Frame 027774/0222 →
Continuity (1)
Related Publication 20130222327A1 · Aug 29, 2013