IP Library Granted Patent US 8,740,408
Granted Patent B2
US 8,740,408 · App. 13/408,262 · Granted Jun 3, 2014

Light emitting diode (LED) module

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Quick Facts
Patent No.
US 8,740,408
App. No.
13/408,262
Granted
Jun 3, 2014
Kind
B2
Abstract

A light emitting diode (LED) module is provided. The LED module includes a substrate on which an LED is mounted; a heat radiation unit configured to include an insertion hole for passage of a power supply cable that supplies power to the substrate; a lens plate configured to include a lens corresponding to the LED and to cover the substrate; a rubber seal configured to be disposed between the heat radiation unit and the lens plate; and a waterproof structure configured to be inserted in the insertion hole and to include a through hole to receive the power supply cable, wherein the substrate is received in an inner space constructed as the lens plate, the rubber seal, and the heat radiation unit are connected, and the inner space has a waterproof structure.

Claims (13)

1. A light emitting diode (LED) module comprising:

a substrate on which an LED is mounted;

a heat radiation unit configured to include an insertion hole for passage of a power supply cable that supplies power to the substrate, wherein the substrate is disposed on the insertion hole;

a lens plate configured to include a lens corresponding to the LED and to cover the substrate;

a rubber seal configured to be disposed between the heat radiation unit and the lens plate; and

a waterproof structure configured to be inserted in the insertion hole and to include a through hole to receive the power supply cable,

wherein the substrate is received in an inner space constructed as the lens plate, the rubber seal, and the heat radiation unit are connected, and the inner space has a waterproof structure.

2. The LED module of claim 1 , wherein the insertion hole has a shape gradually widening toward the inner space.

3. The LED module of claim 1 , wherein the waterproof structure is made of an elastic material.

4. The LED module of claim 1 , wherein the waterproof structure has a shape of which a cross-section increases toward the inner space or a shape of which a portion received in the inner space has a larger cross-section than a portion received in the heat radiation unit.

5. The LED module of claim 4 , wherein a portion of the waterproof structure is compressed by the substrate when the substrate is connected with the heat radiation unit.

6. The LED module of claim 1 , wherein the heat radiation unit is in the form of an aluminum plate.

7. The LED module of claim 1 , wherein the insertion hole has a shape of which a portion adjoining the inner space has a larger cross-section than a portion not adjoining the inner space.

Assignments (1)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →