Solid-state imaging device and electronic apparatus
View Patent ↗A solid-state imaging device including a photoelectric conversion portion; a floating diffusion region; a transfer gate electrode made of an n-type semiconductor; a sidewall made of an n-type semiconductor formed on the photoelectric conversion portion side of the transfer gate electrode with an insulating film therebetween; and a sidewall made of an insulating layer formed on the floating diffusion region side of the transfer gate electrode.
1. A solid-state imaging device comprising a photoelectric conversion portion including a first photodiode and a second photodiode in a unit pixel;
wherein,
a first-conductivity type accumulation layer of the first photodiode is formed so as to extend over a portion of a second-conductivity type semiconductor region of the second photodiode, and
the second photodiode is positioned in the vicinity of a transfer gate electrode and has a higher impurity concentration than the first photodiode.
2. The solid-state imaging device according to claim 1 , wherein:
the first photodiode is constructed as a buried photodiode in which an accumulation region having a conductivity type opposite to a charge accumulation region is formed at the surface, and
the second photodiode is constructed as a photodiode in which charges opposite to signal charges are induced at the surface due to an electric field by the transfer gate electrode or a sidewall made of a semiconductor formed at the transfer gate electrode through an insulating film.
3. The solid-state imaging device according to claim 2 , wherein a sidewall made of a necessary conductive-type semiconductor is formed on the second photodiode side of the transfer gate electrode.
4. The solid-state imaging device according to claim 1 , wherein the second photodiode is constructed as a photodiode in which charges opposite to signal charges are induced at the surface due to an electric field from the sidewall made of a semiconductor and formed at the transfer gate electrode through an insulating film.
5. An electronic apparatus comprising:
a solid-state imaging device;
an optical system which guides incident light to photoelectric conversion portions of the solid-state imaging device; and
a signal processing circuit which processes output signals of the solid-state imaging device,
wherein,
a first-conductivity type accumulation layer of the first photodiode is formed so as to extend over a portion of a second-conductivity type semiconductor region of the second photodiode,
the solid-state imaging device includes a photoelectric conversion portion including a first photodiode and a second photodiode in a unit pixel, and
the second photodiode is positioned in the vicinity of a transfer gate electrode and has a higher impurity concentration than the first photodiode.
6. The electronic apparatus according to claim 5 , wherein:
in the solid-state imaging device, the first photodiode is constructed as a buried photodiode in which an accumulation region having a conductivity type opposite to a charge accumulation region is formed at the surface, and
the second photodiode is constructed as a photodiode in which charges opposite to signal charges are induced at the surface due to an electric field by the transfer gate electrode or a sidewall by a semiconductor formed at the transfer gate electrode through an insulating film.