Dual position DC magnetron assembly
View Patent ↗A sputtering system includes a first sputtering assembly configured to sputter material onto a first disk and a second sputtering assembly configured to sputter material onto a second disk, the second sputtering assembly positioned proximate the first sputtering assembly. The first sputtering assembly includes a first magnetic ring, and the second sputtering assembly includes a second magnetic ring. The first magnetic ring includes a first region of lower relative magnetic strength positioned near the second magnetic ring, and the second magnetic ring includes a second region of lower relative magnetic strength positioned near the first magnetic ring.
1. A method of manufacturing magnetic disks, the method comprising:
providing a sputtering system having a first target and a first magnetic ring associated with the first target, and a second target and a second magnetic ring associated with the second target, the first magnetic ring including a first region of lower relative magnetic strength positioned near the second magnetic ring, and the second magnetic ring including a second region of lower relative magnetic strength positioned near the first magnetic ring;
positioning a first disk at a first sputtering location within the sputtering system, the first sputtering location associated with the first target;
positioning a second disk at a second sputtering location within the sputtering system, the second sputtering location associated with the second target, the second sputtering location proximate the first sputtering location;
generating a first electrical potential difference between a first anode and a first cathode associated with the first sputtering location;
generating a second electrical potential difference between a second anode and a second cathode associated with the second sputtering location; and
concurrently sputtering material from the first target onto the first disk and material from the second target onto the second disk.
2. The method of claim 1 , wherein the first cathode is electrically coupled to the first target, and the second cathode is electrically coupled to the second target.
3. The method of claim 1 , wherein the second disk is positioned such that a center axis of the second disk is approximately 15 cm apart from a center axis of the first disk.
4. The method of claim 1 , wherein generating the first electrical potential difference includes bringing the first anode to a ground potential and bringing the first cathode to a potential of less than −300 V.
5. The method of claim 1 , wherein the first target and the second target include magnetic alloys.
6. The method of claim 1 , wherein the first target and the second target include non-magnetic materials.
7. The method of claim 1 , wherein the first cathode is less than 3 cm apart from the second cathode.
8. The method of claim 1 , wherein the first magnetic ring includes a first plurality of permanent magnets, and the second magnetic ring includes a second plurality of permanent magnets.
9. The method of claim 8 , wherein the first region of lower relative magnetic strength includes at least one permanent magnet less than 10% weaker than other magnets of the first plurality of permanent magnets, and the second region of lower relative magnetic strength includes at least one permanent magnet less than 10% weaker than other magnets of the second plurality of permanent magnets.
10. The method of claim 9 , wherein the first region of lower relative magnetic strength includes at least one permanent magnet approximately 5% weaker than other magnets of the first plurality of permanent magnets, and the second region of lower relative magnetic strength includes at least one permanent magnet approximately 5% weaker than other magnets of the second plurality of permanent magnets.
11. The method of claim 1 , wherein the sputtering system further includes a first inner magnetic ring concentric with and positioned within the first magnetic ring, and a second inner magnetic ring concentric with and positioned within the second magnetic ring.
12. The method of claim 11 , wherein the first magnetic ring is oriented such that a north pole faces the first disk, and the first inner magnetic ring is oriented such that a south pole faces the first disk.
13. The method of claim 1 , further comprising eroding a first approximately circular race track pattern in the first target and a second approximately circular race track pattern in the second target while concurrently sputtering.
14. The method of claim 1 , further comprising concurrently sputtering material from a third target onto an opposite surface of the first disk and material from a fourth target onto an opposite surface of the second disk, while concurrently sputtering the material from the first target and the material from the second target.