Ink-jet head and method of manufacturing ink-jet head
View Patent ↗According to one embodiment, an ink-jet head includes a main body, electrodes, electrically conductive portions, an insulating film, an adhesive, a frame member, a lid member, an electronic component and a protective agent. The main body includes pressure chambers. The electrodes are disposed in the pressure chambers. The electrically conductive portions are disposed on the main body and connected to the electrodes. The insulating film covers the electrodes and a part of the electrically conductive portions. The adhesive covers an end portion of the insulating film. The frame member is located on the end portion of the insulating film and attached to the main body by the adhesive. The electronic component is connected to the electrically conductive portions. The protective agent covers the electrically conductive portions between the electronic component and the frame member.
1. An ink-jet head comprising:
a main body comprising a plurality of pressure chambers;
a plurality of electrodes disposed in the pressure chambers, individually;
a plurality of electrically conductive portions disposed on the main body and connected to the electrodes, individually;
an insulating film which covers the electrodes and a part of the electrically conductive portions;
an adhesive which covers an end portion of the insulating film;
a frame member inside which an ink chamber communicating with the pressure chambers is defined and which is located on the end portion of the insulating film and attached to the main body by the adhesive;
a lid member mounted on the frame member and closing the ink chamber;
an electronic component connected to the electrically conductive portions; and
a protective agent which covers the electrically conductive portions between the electronic component and the frame member.
2. The ink-jet head of claim 1 , wherein the end portion of the insulating film is sealed by the adhesive.
3. The ink-jet head of claim 2 , wherein the protective agent is an ink-resistant adhesive.
4. The ink-jet head of claim 3 , wherein the protective agent adheres to the electronic component.
5. The ink-jet head of claim 3 , wherein the protective agent is an adhesive of the same type as the adhesive for the frame member.
6. The ink-jet head of claim 4 , wherein the electronic component is a driver IC.
7. An ink-jet head comprising:
a substrate;
a piezoelectric member attached to the substrate and comprising a plurality of pressure chambers;
a plurality of electrodes disposed in the pressure chambers, individually;
a plurality of electrically conductive portions disposed on the substrate and connected to the electrodes, individually;
an insulating film which covers the electrodes and a part of the electrically conductive portions;
an adhesive which covers an end portion of the insulating film;
a frame member inside which an ink chamber communicating with the pressure chambers is defined and which is located on the end portion of the insulating film and attached to the main body by the adhesive;
a nozzle plate mounted on the frame member, closing the ink chamber, and comprising a plurality of nozzles opening into the pressure chambers, individually;
an electronic component connected to the electrically conductive portions; and
a protective agent which covers the electrically conductive portions between the electronic component and the frame member.
8. The ink-jet head of claim 7 , wherein the end portion of the insulating film is sealed by the adhesive.
9. The ink-jet head of claim 8 , wherein the protective agent is an ink-resistant adhesive.
10. The ink-jet head of claim 9 , wherein the protective agent adheres to the electronic component.
11. The ink-jet head of claim 9 , wherein the protective agent is an adhesive of the same type as the adhesive for the frame member.
12. The ink-jet head of claim 10 , wherein the electronic component is a driver IC.
13. A method of manufacturing an ink-jet head, comprising:
covering a part of an electrically conductive portion, which is disposed on a main body and connected to an electrode in a pressure chamber, with an insulating film;
bonding a frame member, inside which an ink chamber is defined, to the main body so that an adhesive covers an end portion of the insulating film;
connecting an electronic component to an exposed part of the electrically conductive portion; and
covering the electrically conductive portion between the frame member and the electronic component with a protective agent.
14. The method of manufacturing an ink-jet head of claim 13 , wherein the end portion of the insulating film is sealed with the adhesive.
15. The method of manufacturing an ink-jet head of claim 14 , wherein the protective agent is an ink-resistant adhesive.
16. The method of manufacturing an ink-jet head of claim 15 , wherein the protective agent is adhered to the electronic component.
17. The method of manufacturing an ink-jet head of claim 15 , wherein the protective agent is an adhesive of the same type as the adhesive for the frame member.
18. The method of manufacturing an ink-jet head of claim 16 , wherein the electronic component is a driver IC.