Configurable filter using a transmission line as a delay line
View Patent ↗Methods and systems for a configurable finite impulse response (FIR) filter using a transmission line as a delay line are disclosed and may include selectively coupling one or more taps of a multi-tap transmission line to configure delays for one or more finite impulse response (FIR) filters to enable transmission and/or reception of signals. The delays may be configured based on a location of the one or more selectively coupled taps on the multi-tap transmission line. The FIR filters, which may include one or more stages, may be impedance matched to the selectively coupled taps. The multi-tap transmission line may be integrated on the chip, or a package to which the chip is coupled. The multi-tap transmission line may include a microstrip structure or a coplanar waveguide structure, and may include ferromagnetic material. The distortion of signals in the chip may be compensated utilizing the FIR filters.
1. A method for enabling wireless communication, said method comprising selectively coupling at least one tap of a multi-tap transmission line to configure delays for at least one filter to enable transmission of signals by at least one transmitter in a chip or receiving of signals by at least one receiver in said chip.
2. The method of claim 1 , wherein said at least one transmitter and said at least one receiver are integrated on said chip on a single substrate.
3. The method of claim 1 , wherein said at least one filter is a finite impulse response (FIR) filter.
4. The method of claim 1 further comprising configuring said delays based on a location of said at least one tap of said multi-tap transmission line.
5. The method of claim 1 further comprising impedance matching said at least one filter to said at least one tap on said multi-tap transmission line.
6. The method of claim 1 , wherein said at least one filter comprises a plurality of stages.
7. The method of claim 1 , wherein said multi-tap transmission line is integrated on said chip.
8. The method of claim 1 , wherein said wherein said multi-tap transmission line is integrated on a package to which said chip is bonded.
9. The method of claim 1 , wherein said multi-tap transmission line comprises a microstrip.
10. The method of claim 1 , wherein said multi-tap transmission line comprises a coplanar waveguide.
11. The method of claim 1 , wherein said multi-tap transmission line comprises ferromagnetic material.
12. A system for enabling communication, said system comprising:
a plurality of circuits in a chip, said plurality of circuits comprising at least one filter, a transmitter, and a receiver integrated on a single substrate of said chip, wherein said plurality of circuits are operable to selectively couple at least one tap of a multi-tap transmission line to configure delays for said at least one filter to enable transmission of signals by said transmitter or receiving of signals by receiver.
13. The system of claim 12 , wherein said at least one filter is a finite impulse response (FIR) filter.
14. The system of claim 12 , wherein said plurality of circuits are operable to configure said delays based on a location of said at least one tap of said multi-tap transmission line.
15. The system of claim 12 , wherein said plurality of circuits are operable to impedance match said at least one filter to said at least one tap of said multi-tap transmission line.
16. The system of claim 12 , wherein said multi-tap transmission line is integrated on said chip.
17. The system of claim 12 , wherein said multi-tap transmission line is integrated on a package to which said chip is bonded.
18. The system of claim 12 , wherein said multi-tap transmission line comprises a microstrip.
19. The system of claim 12 , wherein said multi-tap transmission line comprises a coplanar waveguide.
20. The system of claim 12 , wherein said multi-tap transmission line comprises ferromagnetic material.