Glass/resin laminate, and electronic device using same

1. A glass/resin laminate comprising a glass substrate and a resin layer,

wherein the resin layer contains a polyimide obtained by condensation polymerization of an aromatic diamine having a benzoxazole structure with an aromatic tetracarboxylic anhydride,

the difference in the average linear expansion coefficient at 25 to 300° C. between the glass substrate and the resin layer is from −100×10 −7 to +100×10 −7 /° C., and

at least one outermost layer of the laminate is the glass substrate, and wherein the glass substrate and the resin layer are in direct contact.

2. The glass/resin laminate according to claim 1 , wherein at least either one surface of mutual contact surfaces of the glass substrate and the resin layer is surface-treated.

3. The glass/resin laminate according to claim 2 , wherein the surface treatment contains at least anyone of a corona treatment, a plasma treatment, a flame treatment and a silane coupling treatment.

4. The glass/resin laminate according to claim 1 ,

wherein the glass substrate is in a rectangular or belt shape; and

the size in width direction of the glass substrate is 2,000 mm or less.

5. The glass/resin laminate according to claim 1 , wherein the thickness of the glass substrate is 0.3 mm or less.

6. The glass/resin laminate according to claim 1 , wherein the thickness of the resin layer is 0.1 mm or less.

7. An electronic device comprising the glass/resin laminate according to claim 1 .

8. A glass substrate laminate comprising the glass/resin laminate according to claim 1 , a support plate, and a releasable resin layer having a releasable surface,

wherein the glass/resin laminate and the support plate are laminated through the releasable resin layer so that the outermost surface of the other outermost layer of the glass/resin laminate and the releasable surface of the releasable resin layer fixed to the surface of the support plate are put into close contact.

9. The glass substrate laminate according to claim 8 , wherein the releasable resin layer contains at least anyone of an acrylic resin, a polyolefin resin, a polyurethane resin and a silicone resin.

10. The glass substrate laminate according to claim 8 , wherein the thickness of the glass/resin laminate is from 50 to 400 μm.

11. The glass substrate laminate according to claim 8 , wherein the material of the support plate contains a material having a 5% heating weight loss temperature of 300° C. or more.

12. The glass substrate laminate according to claim 8 , wherein the support plate is formed of a glass plate, a silicon wafer, a plastic plate or a metal plate, and has a thickness of 0.3 mm or more.

13. A method for producing the glass substrate laminate according to claim 8 , comprising:

a releasable resin layer forming step of forming and fixing the releasable resin layer on the support plate, and

a close contact step of putting the outermost surface of the other outermost layer of the glass/resin laminate and the releasable surface of the releasable resin layer into close contact.

14. A glass substrate laminate for production of an electronic device, obtained by forming at least a part of constituent members of the electronic device on the glass substrate surface of the glass substrate laminate according to claim 8 .

15. A method for producing an electronic device having a glass/resin laminate, comprising forming at least a part of constituent members of the electronic device on the glass substrate surface of the glass substrate laminate according to claim 8 and thereafter, separating the glass/resin laminate from the releasable resin layer.