Radio frequency (RF) particles
View Patent ↗The present disclosure generally describes radio frequency (RF) particles and an RF powder-containing base including a plurality of such RF particles. The RF particles may include an antenna element and an integrated circuit element coupled together by at least one interconnection. The base may be formed from sheet-like subjects, such as various kinds of cards, bills, and documents. Methods of forming the RF powder-containing base are also generally disclosed.
1. A radio frequency particle, comprising:
an integrated circuit overlying and in direct contact with a substrate;
an insulating layer overlying and in direct contact with the integrated circuit such that the integrated circuit is positioned between the substrate and the insulating layer;
an antenna element overlying and in direct contact with the insulating layer; and at least one interconnection coupling the integrated circuit with the antenna element,
wherein a longest side of the radio frequency particle is less than or equal to 0.30 millimeters.
2. The radio frequency particle of claim 1 , further comprising an electrical circuit element for exchanging signals with an external device via radio frequency electromagnetic waves.
3. The radio frequency particle of claim 2 , wherein the electrical circuit element comprises at least one transistor.
4. The radio frequency particle of claim 1 , wherein the substrate comprises silicon.
5. The radio frequency particle of claim 1 , wherein the integrated circuit comprises at least one of a rectifier circuit, a voltage suppressor, an initialization circuit, a clock circuit, a control register, a decoder, and memory.
6. The radio frequency particle of claim 1 , wherein the at least one interconnection is embedded in the insulating layer.
7. A radio frequency powder-containing base, comprising:
a plurality of radio frequency powder particles dispersed in the base, each of the radio frequency powder particles, comprising:
an integrated circuit overlying a substrate;
an insulating layer overlying the integrated circuit;
at least one antenna element disposed in the insulating layer and having an exposed surface; and
at least one interconnection extending from the integrated circuit to the antenna element,
wherein the plurality of radio frequency powder particles comprises first particles sensitive to electromagnetic waves having a first frequency and second particles sensitive to electromagnetic waves having a second frequency, the first frequency being different from the second frequency.
8. The radio frequency powder-containing base of claim 7 , further comprising third particles sensitive to electromagnetic waves having a third frequency different from the first and second frequencies.
9. The radio frequency powder-containing base of claim 7 , wherein the radio frequency powder particles are dispersed within a region of the base having a sheet-like shape.
10. The radio frequency powder-containing base of claim 7 , wherein the base comprises at least one of paper and plastic.
11. The radio frequency powder-containing base of claim 7 , wherein the base comprises a bill, a credit card, a document, or a business card.
12. A method of forming a base including a plurality of radio frequency powder particles, each of the radio frequency particles comprising an integrated circuit overlying a substrate, an insulating layer overlying the integrated circuit, at least one antenna element disposed in the insulating layer and having an exposed surface, and at least one interconnection extending from the integrated circuit to the antenna element, the method comprising:
forming a first adhesive-containing solution containing the first radio frequency powder particles responsive to electromagnetic waves having a first frequency;
forming a second adhesive-containing solution containing the second radio frequency powder particles responsive to electromagnetic waves having a second frequency different from the first frequency; and
applying the first and second adhesive-containing solutions to the base.
13. The method of claim 12 , wherein applying the first and second adhesive-containing solutions to the base comprises dispersively spreading the first and second radio frequency powder particles over the base.
14. The method of claim 12 , wherein applying the first and second adhesive-containing solutions to the base comprises soaking the base in an aqueous solution filled with an adhesive fixative containing the first or second radio frequency powder particles to attach the first or second radio frequency powder particles to the base.
15. The method of claim 12 , wherein applying the first and second adhesive-containing solutions to the base comprises applying the first and second adhesive-containing solutions to at least one of paper and plastic.
16. The method of claim 12 , wherein applying the first and second adhesive-containing solutions to the base comprises applying a mixture of the first and second adhesive-containing solutions to form a sheet-like layer of the first and second radio frequency powder particles over the base.