Field barrier structures within a conformal shield
View Patent ↗In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
1. A meta-module comprising:
a substrate;
a ground plane located inside of the substrate or located on a bottom surface of the substrate;
a component area located on a top surface of the substrate, wherein the component area includes a first electronic component and a second electronic component;
a metallic layer grid located on the top surface of the substrate and substantially surrounding the component area;
a dielectric body substantially covering the component area;
an electromagnetic shield substantially covering the dielectric body, and in electrical communication with the metallic layer grid;
a shield via electrically connecting the metallic layer grid to the ground plane through the substrate, such that the electromagnetic shield, the metallic layer grid, the shield via, and the ground plane are all in electrical communication with each other;
a first field barrier structure, wherein the first field barrier structure begins at an upper portion of the electromagnetic shield, extends downward through the dielectric body, and extends further downward through the component area, such that the first field barrier structure is in electrical communication with the electromagnetic shield, the metallic layer grid, the shield via, and the ground plane, and
wherein the first field barrier structure is configured to reduce electromagnetic interference between the first electrical component and the second electronic component.
2. The meta-module of claim 1 , further comprising:
a first field barrier structure via located inside of the substrate and electrically connecting the ground plane with the first field barrier structure.
3. The meta-module of claim 1 , wherein a lower surface of the first field barrier structure terminates on the top surface of the substrate, and wherein the first field barrier structure is in electrical communication with the ground plane only through a path including the electromagnetic shield, the metallic layer grid, and the shield via.
4. The meta-module of claim 1 , further comprising:
a second field barrier structure; and
a third electronic component, and
wherein the first field barrier structure is located adjacent to the first electronic component and to the second electronic component, such that the first field barrier structure reduces electromagnetic interference between the first electronic component and the second electronic component, and
wherein the second field barrier structure is located adjacent to the second electronic component and to the third electronic component, such that the second field barrier structure reduces electromagnetic interference between the second electronic component and the third electronic component.
5. The meta-module of claim 1 , wherein the second electronic component is substantially rectangular, and wherein the first field barrier structure and the second field barrier structure are located diagonally across from each other relative to the second electronic component.
6. The meta-module of claim 5 , further comprising additional electronic components and additional field barrier structures, wherein the field barrier structures are staggered between the electronic components.
7. The meta-module of claim 1 , wherein the field barrier structure is cylindrically shaped.
8. The meta-module of claim 1 , wherein the field barrier structure is shaped like a wall.
9. The meta-module of claim 1 , wherein the first field barrier structure is located between a first wall of the first electronic component and a first wall of the second electronic component.