IP Library Granted Patent US 8,743,265
Granted Patent B2
US 8,743,265 · App. 13/416,580 · Granted Jun 3, 2014

Solid-state imaging device with lens, method of manufacturing solid-state imaging device with lens, and electronic apparatus

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Quick Facts
Patent No.
US 8,743,265
App. No.
13/416,580
Granted
Jun 3, 2014
Kind
B2
Abstract

A solid-state imaging device includes a pixel that has a photoelectric conversion section which converts incident light into an electric signal; a color filter which is formed corresponding to the pixel; a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and an in-layer lens which is formed between the color filter and the micro lens and has a refractive index smaller than that of the micro lens.

Claims (11)

1. A solid-state imaging device comprising: a pixel that has a photoelectric conversion section which converts incident light into an electric signal; a color filter which is formed corresponding to the pixel; a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and an in-layer lens which is formed between the color filter and the micro lens and has a refractive index smaller than that of the micro lens, wherein the in-layer lens has a lens diameter smaller than that of the micro lens and a length of the lens diameter is based on a desired refractive index.

2. The solid-state imaging device according to claim 1 , wherein both of the micro lens and the in-layer lens are a convex lens.

3. The solid-state imaging device according to claim 1 , wherein the in-layer lens includes a lens of multi-layers and has the smallest refractive index by the lens of the layer close to the color filter.

4. The solid-state imaging device according to claim 1 , wherein the pixel, the micro lens, and the in-layer lens are formed on a substrate, and centers of the micro lens and the in-layer lens provided on a periphery of substrate are placed so as to be shifted to a center of the corresponding pixel in a center direction of the substrate.

5. The solid-state imaging device according to claim 4 , wherein an amount, by which the center of the in-layer lens is shifted to the center of the pixel, is smaller than an amount by which the center of the micro lens is shifted.

6. A solid-state imaging device comprising: a pixel that has a photoelectric conversion section which converts incident light into an electric signal; a color filter which is formed corresponding to the pixel; a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and an in-layer lens which is formed between the color filter and the micro lens and has a refractive index greater than that of the micro lens, wherein the in-layer lens has a lens diameter smaller than that of the micro lens and a length of the lens diameter is based on a desired refractive index.

7. A solid-state imaging device comprising: a pixel that has a photoelectric conversion section which converts incident light into an electric signal; a color filter which is formed corresponding to the pixel; a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and an in-layer lens of n-th layer (n>1) which is formed between the color filter and the micro lens, emits the incident light focused by the micro lens, and causes the incident light to be incident to the photoelectric conversion section, wherein the micro lens is a convex lens and the in-layer lens is a concave lens and wherein the in-layer lens includes a lens of multi-layers and the lens of the layer closest to the color filter has the greatest refractive index.

8. A solid-state imaging device comprising: a pixel that has a photoelectric conversion section which converts incident light into an electric signal; a color filter which is formed corresponding to the pixel; a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and

an in-layer lens which is formed between the color filter and the micro lens and emits the incident light focused by the micro lens, wherein the in-layer lens has a lens diameter smaller than that of the micro lens and a length of the lens diameter is based on a desired refractive index.

9. A method of manufacturing a solid-state imaging device comprising: forming a pixel which has a photoelectric conversion section which converts incident light into an electric signal; forming a color filter which is formed corresponding to the pixel; forming a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and forming an in-layer lens of an n-th layer (n>1) which is formed between the color filter and the micro lens and has a refractive index smaller than that of the micro lens, wherein the micro lens is a convex lens and the in-layer lens is a concave lens and wherein the in-layer lens includes a lens of multi-layers and the lens of the layer closest to the color filter has the greatest refractive index.

10. An electronic apparatus comprising: a solid-state imaging device which includes a pixel that has a photoelectric conversion section which converts incident light into an electric signal; a color filter which is formed corresponding to the pixel; a micro lens which focuses the incident light to the photoelectric conversion section via the color filter; and an in-layer lens of an n-th layer (n>1) which is formed between the color filter and the micro lens and has a refractive index smaller than that of the micro lens; an optical lens which guides the incident light to the photoelectric conversion section; and a signal processing circuit which processes the electric signal, wherein the micro lens is a convex lens and the in-layer lens is a concave lens and wherein the in-layer lens includes a lens of multi-layers and the lens of the layer closest to the color filter has the greatest refractive index.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2012
From: TOUMIYA, YOSHINORI; OOTSUKA, YOICHI
To: SONY CORPORATION
Reel/Frame 027836/0843 →