Anti-reflection structures for CMOS image sensors
Optical structures having an array of protuberances between two layers having different refractive indices are provided. The array of protuberances has vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode of a CMOS image sensor. The array of protuberances provides high transmission of light with little reflection. The array of protuberances may be provided over a photodiode, in a back-end-of-line interconnect structure, over a lens for a photodiode, on a backside of a photodiode, or on a window of a chip package.
1. A semiconductor structure comprising:
a photodiode located in a semiconductor layer;
a transistor located on said semiconductor layer, wherein a source of said transistor is of integral construction with said photodiode; and
a dielectric layer located overlying said photodiode, laterally surrounding and overlying a gate electrode of said transistor, and comprising a protuberance-containing dielectric portion which overlies said photodiode and includes an array of protuberances, wherein a pitch of said array of protuberances is less than 270 nm.
2. The semiconductor structure of claim 1 , further comprising an intermediate dielectric layer vertically abutting said photodiode, said gate electrode, and said dielectric layer.
3. The semiconductor structure of claim 1 , wherein said dielectric layer vertically abuts said photodiode and said gate electrode.
4. The semiconductor structure of claim 1 , wherein said pitch is a sub-lithographic dimension.
5. The semiconductor structure of claim 1 , wherein said dielectric layer further comprises a flat dielectric portion located over said gate electrode and a drain region of said transistor and having a same composition as said protuberance-containing dielectric portion.
6. A semiconductor structure comprising:
a photodiode located in a semiconductor layer;
a transistor located on said semiconductor layer, wherein a source of said transistor is of integral construction with said photodiode; and
a dielectric layer located overlaying said photodiode, laterally surrounding and overlying a gate electrode of said transistor, and comprising a protuberance-containing dielectric portion which overlies said photodiode and includes an array of protuberances, wherein said dielectric layer further comprises a flat dielectric portion located over said gate electrode and a drain region of said transistor and having a same composition as said protuberance-containing dielectric portion, and wherein said flat dielectric portion has a first thickness, and wherein each of said protuberances has a height from a base to an apex, and wherein said protuberance-containing dielectric portion comprises a constant thickness portion abutting each base of said protuberances and having a second thickness, wherein said first thickness is substantially equal to a sum of said second thickness and said height.
7. The semiconductor structure of claim 6 , further comprising an intermediate dielectric layer vertically abutting said photodiode, said gate electrode, and said dielectric layer.
8. The semiconductor structure of claim 6 , wherein said dielectric layer vertically abuts said photodiode and said gate electrode.
9. The semiconductor structure of claim 6 , wherein a pitch of said array of protuberances is less than 270 nm.
10. The semiconductor structure of claim 9 , wherein said pitch is a sub-lithographic dimension.
11. A semiconductor structure comprising:
a photodiode located in a semiconductor layer;
a dielectric material layer containing a lens and located over said photodiode, wherein said lens is located in an optical path of said photodiode; and
a protuberance-containing dielectric portion located directly on said dielectric material layer, wherein said protuberance-containing dielectric portion comprises an array of protuberances.
12. The semiconductor structure of claim 11 , wherein said lens is a flat-top convex-bottom lens vertically abutting a bottom surface of said protuberance-containing dielectric portion.
13. The semiconductor structure of claim 11 , wherein said lens is a convex-top flat-bottom lens embedded in said dielectric material layer and separated from and located underneath said protuberance-containing dielectric portion.
14. The semiconductor structure of claim 11 , wherein said protuberance-containing dielectric portion has an interface with an ambient gas or vacuum.
15. The semiconductor structure of claim 11 , further comprising a bond pad located in a metal pad area and having an exposed bond pad top surface, wherein dielectric material layer is located above said bond pad outside said metal pad area.
16. The semiconductor structure of claim 11 , further comprising a flat dielectric portion having a same composition as, and being of integral construction as, said protuberance-containing dielectric portion, and vertically abutting said dielectric material layer.
17. The semiconductor structure of claim 16 , wherein said flat dielectric portion has a first thickness, and wherein each of said protuberances has a height from a base to an apex, and wherein said protuberance-containing dielectric portion comprises a constant thickness portion abutting each base of said protuberances and having a second thickness, wherein said first thickness is substantially equal to a sum of said second thickness and said height.