IP Library Granted Patent US 8,763,467
Granted Patent B2
US 8,763,467 · App. 13/419,543 · Granted Jul 1, 2014

Pressure sensor device

Inventors: Takuya Ishihara (Tokyo, JP); Hidefumi Harada (Tokyo, JP); Masashi Sekine (Tokyo, JP)
Assignee: Azbil Corporation
G01L9/12G01L9/0044
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Quick Facts
Patent No.
US 8,763,467
App. No.
13/419,543
Granted
Jul 1, 2014
Kind
B2
Abstract

A pressure sensor device has a sensor detecting pressure of a gas that is introduced from the outside, a heater for heating the sensor, a package containing the sensor and the heater, a circuit portion producing an output signal that represents the pressure of the gas based on the detection output detected by the sensor, and a circuit containing portion containing the circuit portion. The package and the circuit containing portion are structured from separate cases and are disposed separately with a connecting structural member interposed therebetween. The connecting structural member 90 includes electrode lead pins connecting between the sensor within the package and the circuit portion within the circuit containing portion, insulated pipes for covering the outer peripheries of the electrode lead pins, and coil springs covering the outer peripheries of the insulated pipes.

Claims (14)

1. A pressure sensor device comprising:

a sensor detecting a pressure of a gas introduced from the outside,

a heater heating the sensor to a specific operating temperature,

a package containing the sensor and the heater,

a circuit portion producing an output signal representing the pressure of the gas, based on the detection output detected by the sensor, and a circuit containing portion containing the circuit portion,

wherein the package and the circuit containing portion are structured from separate cases and are disposed separately with a connecting structural member interposed therebetween; and

wherein the connecting structural member comprises:

a conductive line connecting between the sensor within the package and the circuit portion within the circuit containing portion,

an insulated member covering the outer periphery of the conductive line, and

an elastic member covering the outer periphery of the insulated member.

2. The pressure sensor device as set forth in claim 1 , wherein:

the insulated member is structured by layering a plurality of pipe-shaped members, formed from an insulating material, in the lengthwise direction of the conductive line.

3. The pressure sensor device as set forth in claim 1 , wherein:

the elastic member is structured from a coil spring.

Assignments (2)
CHANGE OF NAME Recorded May 10, 2012
From: YAMATAKE CORPORATION
To: AZBIL CORPORATION
Reel/Frame 028187/0739 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2012
From: ISHIHARA, TAKUYA; HARADA, HIDEFUMI; SEKINE, MASASHI
To: YAMATAKE CORPORATION
Reel/Frame 027859/0851 →
Priority Claims (1)
JP 2011-078478 · Mar 31, 2011 · national
Continuity (1)
Related Publication 20120247216A1 · Oct 4, 2012