Method of fabricating thin film transistor

1. A method of fabricating a thin film transistor, the method comprising:

forming a buffer layer on a substrate;

forming an amorphous semiconductor layer on the buffer layer;

patterning the amorphous semiconductor layer to form an amorphous semiconductor pattern;

forming a gate insulating layer on the amorphous semiconductor pattern;

forming a semiconductor pattern access hole in the gate insulating layer;

forming a metal layer on the substrate, the metal layer covering the gate insulating layer, and being in the semiconductor pattern access hole so as to be in contact therethrough with the amorphous semiconductor pattern;

passing an electric current through the metal layer so as to convert the amorphous semiconductor pattern to a crystallized semiconductor pattern using heat generated by the electric current;

patterning the metal layer to form a gate electrode corresponding to the crystallized semiconductor pattern;

forming an interlayer insulating layer on the gate electrode;

forming two first source/drain contact holes in the gate insulating layer and two source/drain contact holes in the interlayer insulating layer; and

forming source and drain electrodes connected to the semiconductor layer through the first and second source/drain contact holes.

2. The method as claimed in claim 1 , wherein the crystallization is performed while the metal layer is in contact with the amorphous semiconductor pattern through the semiconductor pattern access hole.

3. The method as claimed in claim 1 , wherein the electric current is generated by applying an electrical field of about 100 V/cm 2 to about 10,000 V/cm 2 to the metal layer.

4. The method as claimed in claim 1 , wherein the gate electrode is formed to a thickness of about 50 nm to about 200 nm.

5. The method as claimed in claim 1 , wherein the semiconductor pattern access hole is spaced apart from the first source/drain contact holes.

6. The method as claimed in claim 1 , wherein the semiconductor pattern access hole is formed to correspond to a region other than a channel region of the crystallized semiconductor pattern.

7. The method as claimed in claim 1 , wherein the semiconductor pattern access hole partially exposes the crystalline semiconductor pattern and the exposed crystalline semiconductor pattern is in contact with the interlayer insulating layer through the semiconductor pattern access hole.

8. The method as claimed in claim 1 , wherein:

the semiconductor pattern access hole is spaced apart from the first source/drain contact holes,

the semiconductor pattern access hole is at an upper region of the semiconductor pattern, and

the semiconductor pattern access hole corresponds to a region other than a channel region of the semiconductor pattern.

9. The method as claimed in claim 1 , wherein the gate electrode is formed of aluminum, chromium, molybdenum, or a combination thereof.

10. The method as claimed in claim 1 , wherein the gate insulating layer includes two or more semiconductor pattern access holes therein.

11. A method of fabricating a thin film transistor, the method comprising:

forming a buffer layer on a substrate;

forming a crystalline semiconductor pattern on the buffer layer;

forming a gate insulating layer on the crystalline semiconductor pattern, the gate insulating layer having two first source/drain contact holes and a semiconductor pattern access hole therein, the semiconductor pattern access hole partially exposing the crystalline semiconductor pattern;

forming a gate electrode on the gate insulating layer, the gate electrode being between the two first source/drain contact holes;

forming an interlayer insulating layer covering the gate electrode, the interlayer insulating layer having two second source/drain contact holes therein, the exposed crystalline semiconductor pattern being in contact with the interlayer insulating layer through the semiconductor pattern access hole; and

forming source and drain electrodes on the interlayer insulating layer, each of the source and drain electrodes being insulated from the gate electrode, and having a portion connected to the crystalline semiconductor pattern through the first and second source/drain contact hole.

12. The method as claimed in claim 11 , wherein the crystallization is performed while the metal layer is in contact with the amorphous semiconductor pattern through the semiconductor pattern access hole.

13. The method as claimed in claim 11 , wherein the electric current is generated by applying an electrical field of about 100 V/cm 2 to about 10,000 V/cm 2 to the metal layer.

14. The method as claimed in claim 11 , wherein the gate electrode is formed to a thickness of about 50 nm to about 200 nm.

15. The method as claimed in claim 11 , wherein the semiconductor pattern access hole is spaced apart from the first source/drain contact holes.

16. The method as claimed in claim 11 , wherein the semiconductor pattern access hole is formed to correspond to a region other than a channel region of the crystallized semiconductor pattern.

17. The method as claimed in claim 11 , wherein:

the semiconductor pattern access hole is spaced apart from the first source/drain contact holes,

the semiconductor pattern access hole is at an upper region of the semiconductor pattern, and

the semiconductor pattern access hole corresponds to a region other than a channel region of the semiconductor pattern.

18. The method as claimed in claim 11 , wherein the gate electrode is formed of aluminum, chromium, molybdenum, or a combination thereof.

19. The method as claimed in claim 11 , wherein the gate insulating layer includes two or more semiconductor pattern access holes therein.