Fixture for substrate cutting
View Patent ↗A fixture for cutting thin substrates, such as films, wafers, semiconductor layers and the like, using a blade holder assembly joined to a substrate clamp assembly. Each assembly has a plurality of members with the substrate clamp having a base plate that introduces a vacuum environment and a substrate support plate that uses the vacuum to secure the substrate in place. The blade holder assembly has interlocking projections in interleaving sheet members sandwiched between two bracket members that define slots for supporting a knife. Multiple slots allow the blade to be positioned in different positions and different orientations for cutting thin substrates held with vacuum pressure in the substrate clamp assembly.
1. A fixture for cutting thin substrates with a blade comprising:
a thin substrate clamp; and
a blade holder assembly disposed over the thin substrate clamp, the blade holder assembly having first and second sheets establishing a central open area over the thin substrate clamp and having inwardly facing blade guide members with slots formed therebetween surrounding the open area, opposed slots accommodating blades in selected planes perpendicular to a top surface of the first and second sheets, wherein first and second sheets have alternating inwardly facing blade guide projections and indentations with which surfaces are shared, said inwardly facing blade guide projections of one sheet occupying opposing indentations of the other sheet, wherein a slot comprises area in an indentation of one sheet disposed between an inwardly facing guide projection of one sheet and an inwardly facing blade guide projection of the other sheet occupying the indentation;
whereby a thin substrate secured by the thin substrate clamp may be sheared along the selected plane by a blade moving in the selected plane toward the thin substrate.
2. The apparatus of claim 1 wherein the blade holder assembly comprises:
first and second brackets each having a periphery surrounding the central open area wherein the first and second sheets are sandwiched by the brackets.
3. The apparatus of claim 1 wherein the thin substrate clamp is a vacuum chuck.
4. The apparatus of claim 1 wherein the thin substrate clamp comprises a thin substrate support plate having a lower surface communicating with the vacuum plenum and a planar upper surface having a plurality of vacuum ports arranged in a pattern for contact with a thin substrate disposed on the thin substrate support plate in a planar relation secured by the vacuum ports.
5. The apparatus of claim 1 wherein said indentations are diagonally symmetric.
6. The apparatus of claim 1 wherein the selected plane along which the blade moves is disposed to extend past the thin substrate.