Nitride semiconductor device
A nitride semiconductor device includes a first semiconductor layer, a second semiconductor layer, a conductive substrate, a first electrode, a second electrode, and a control electrode. The second semiconductor layer is directly bonded to the first semiconductor layer. The conductive substrate is provided on and electrically connected to the first semiconductor layer. The first electrode and the second electrode are provided on and electrically connected to a surface of the second semiconductor layer on a side opposite to the first semiconductor layer. The control electrode is provided on the surface of the second semiconductor layer between the first electrode and the second electrode. The first electrode is electrically connected to a drain electrode of a MOSFET formed of Si. The control electrode is electrically connected to a source electrode of the MOSFET. The conductive substrate is electrically connected to a gate electrode of the MOSFET.
1. A nitride semiconductor device, comprising:
a first semiconductor layer having a first surface and a second surface on a side opposite to the first surface, the first semiconductor layer including Al x Ga 1-x N (0≦x<1);
a second semiconductor layer bonded to the first surface, the second semiconductor layer including non-doped or n-type Al y Ga 1-y N (0<y≦1 and x<y);
a conductive substrate provided on the second surface side of the first semiconductor layer and electrically connected to the first semiconductor layer;
a first electrode electrically connected to a surface of the second semiconductor layer on a side opposite to the first semiconductor layer;
a second electrode provided electrically connected to the surface of the second semiconductor layer;
a control electrode provided on the surface of the second semiconductor layer between the first electrode and the second electrode;
a first terminal;
a second terminal; and
a third terminal,
the first electrode being electrically connected to a drain electrode of a MOSFET formed of Si,
the control electrode being electrically connected to a source electrode of the MOSFET,
the conductive substrate being electrically connected to a gate electrode of the MOSFET,
the first terminal electrically connected to the second electrode,
the second terminal electrically connected to the gate electrode of the MOSFET, and
the third terminal electrically connected to the source electrode of the MOSFET.
2. The device according to claim 1 , further comprising a back surface electrode electrically connected to a surface of the conductive substrate on a side opposite to the first semiconductor layer,
the conductive substrate being electrically connected to the gate electrode of the MOSFET via the back surface electrode.
3. The device according to claim 1 , wherein the conductive substrate has a p conductivity type.
4. The device according to claim 1 , wherein a capacitance between the first terminal and the second terminal varies in accordance with an applied voltage on the second terminal.
5. A nitride semiconductor device, comprising:
a first semiconductor layer having a first surface and a second surface on a side opposite to the first surface, the first semiconductor layer including Al x Ga 1-x N (0≦x<1);
a second semiconductor layer bonded to the first surface, the second semiconductor layer including non-doped or n-type Al y Ga 1-y N (0<y≦1 and x<y);
a conductive substrate provided on the second surface side of the first semiconductor layer and electrically connected to the first semiconductor layer;
a first electrode electrically connected to a surface of the second semiconductor layer on a side opposite to the first semiconductor layer;
a second electrode electrically connected to the surface of the second semiconductor layer;
a control electrode provided on the surface of the second semiconductor layer between the first electrode and the second electrode;
a first terminal;
a second terminal; and
a third terminal,
the first electrode being electrically connected to a drain electrode of a MOSFET formed of Si,
the control electrode being electrically connected to a source electrode of the MOSFET,
the conductive substrate being electrically connected to the source electrode of the MOSFET,
the first terminal electrically connected to the second electrode,
the second terminal electrically connected to the gate electrode of the MOSFET, and
the third terminal electrically connected to the source electrode of the MOSFET.
6. The device according to claim 5 , wherein the conductive substrate has a p conductivity type.
7. The device according to claim 5 , wherein a capacitance between the first terminal and the third terminal varies in accordance with an applied voltage on the third terminal.
8. The device according to claim 5 , further comprising:
a back surface electrode electrically connected to a surface of the conductive substrate on a side opposite to the first semiconductor layer,
the conductive substrate being electrically connected to the source electrode of the MOSFET via the back surface electrode.
9. A nitride semiconductor device, comprising:
a first semiconductor layer having a first surface and a second surface on a side opposite to the first surface, the first semiconductor layer being made of non-doped Al x Ga 1-x N (0≦x<1);
a second semiconductor layer directly bonded to the first surface, the second semiconductor layer being made of non-doped or n-type Al x Ga 1-y N (0<y≦1 and x<y);
a conductive substrate provided on the second surface side of the first semiconductor layer to be electrically connected to the first semiconductor layer;
a first electrode provided to be electrically connected to a surface of the second semiconductor layer on a side opposite to the first semiconductor layer;
a second electrode provided to be electrically connected to the surface of the second semiconductor layer; and
a control electrode provided on the surface of the second semiconductor layer between the first electrode and the second electrode,
the first electrode being electrically connected to a drain electrode of a MOSFET formed of Si,
the control electrode being electrically connected to a source electrode of the MOSFET,
the conductive substrate being electrically connected to a gate electrode of the MOSFET,
wherein the conductive substrate has a p conductivity type, and the control electrode is provided inside a recess with an insulating film interposed, the recess piercing the second semiconductor layer to expose the first semiconductor layer at the bottom of the recess.