IP Library Granted Patent US 9,029,877
Granted Patent B2
US 9,029,877 · App. 13/420,908 · Granted May 12, 2015

Light-emitting diode package

Inventors: Sangwoo Lee (Seoul, KR); Sunghee Won (Seoul, KR)
Assignee: LG Innotek Co., Ltd.
H01L25/0753H01L33/486H01L33/62H01L2924/0002
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Quick Facts
Patent No.
US 9,029,877
App. No.
13/420,908
Granted
May 12, 2015
Kind
B2
Abstract

Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.

Claims (28)

1. A light-emitting device (‘LED’) package, comprising:

a body including a cavity;

a lead frame disposed in the cavity; and

a light-emitting device (‘LED’) electrically connected to the lead frame, the LED being inclined at a prescribed angle relative to a bottom surface of the cavity and including a light emitting part and a non-light emitting part,

wherein a recess is provided on the bottom surface of the cavity to accommodate the LED at the prescribed angle relative to the bottom surface.

2. The LED package according to claim 1 , wherein a connection part is formed by recessing a region of the bottom surface of the cavity.

3. The LED package according to claim 2 , wherein the connection part has a slope angle relative to the bottom surface of the cavity.

4. The LED package according to claim 2 , wherein the light emitting part is disposed higher than the bottom surface of the cavity.

5. The LED package according to claim 1 , wherein the light emitting part emits light and the non-light emitting part supports the light emitting part.

6. The LED package according to claim 1 , further comprising a filler disposed between a connection part and the LED.

7. The LED package according to claim 1 , wherein the LED are two LEDs and the two LEDs face each other.

8. The LED package according to claim 7 , wherein the two LEDs are inclined at the same prescribed angle relative to the bottom surface of the cavity.

9. The LED package according to claim 1 , further comprising a wavelength conversion layer arranged to surround the LED.

10. An light-emitting device (‘LED’) package, comprising:

a body including a cavity;

a lead frame disposed in the cavity; and

an LED electrically connected to the lead frame, the LED being inclined at a prescribed angle relative to a bottom surface of the cavity and including a light emitting part and a non-light emitting part,

wherein a recess is provided on an upper surface of the lead frame inside the cavity to accommodate the LED at the prescribed angle relative to the bottom surface, the non-light emitting part being provided in the recess and the light emitting part being provided outside the recess.

11. The LED package according to claim 10 , wherein the LED is two LEDs and the two LEDs face each other.

12. The LED package according to claim 11 , wherein the two LEDs are inclined at the same prescribed angle relative to the bottom surface of the cavity.

13. The LED package according to claim 10 , further comprising a wavelength conversion layer surrounding the LED.

14. A lighting system comprising the LED package according to claim 1 .

15. The LED package of claim 1 , wherein the recess includes a first surface that is inclined at the prescribed angle relative to the bottom surface of the cavity and a second surface perpendicular to the first surface.

16. The LED package of claim 15 , wherein the LED is mounted in the cavity to correspond to the recess, a lateral surface of the LED being parallel to the first surface and a bottom surface of the LED being parallel to the second surface.

17. The LED package of claim 1 , wherein the lead frame is provided between the LED and the recess.

18. The LED package of claim 1 , wherein the lead frame provided in the cavity has a prescribed shape that corresponds to a shape of the recess and provided in the recess.

19. The LED package of claim 18 , wherein the prescribed shape of the lead frame includes a recess formed on an upper surface of the lead frame, the LED being provided in the recess on the lead frame and inclined at the prescribed angle relative to the bottom surface of the cavity.

20. The LED package of claim 10 , wherein a recess is provided on the bottom surface of the cavity, the recess on the lead frame being provided to correspond to the recess on the bottom surface of the cavity.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2012
From: LEE, SANGWOO; WON, SUNGHEE
To: LG INNOTEK CO., LTD.
Reel/Frame 027868/0324 →
Priority Claims (1)
KR 10-2011-0055019 · Jun 8, 2011 · national
Continuity (1)
Related Publication 20120313117A1 · Dec 13, 2012