IP Library Granted Patent US 8,467,051
Granted Patent B2
US 8,467,051 · App. 13/421,012 · Granted Jun 18, 2013

Widely-tunable semiconductor source integrated in windowed hermetic package

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Quick Facts
Patent No.
US 8,467,051
App. No.
13/421,012
Granted
Jun 18, 2013
Kind
B2
Abstract

A near infrared (NIR) semiconductor laser system is shown for gas sensing. An embodiment is centered on the use of a system with a much wider tunable laser, which today has a scan band of more than 150 nanometers (nm) to as much as 250 nm or more. In some cases the scan band is about 400 nm or more. This is achieved in the current embodiment through the use of a widely tunable microelectromechanical system (MEMS) based Fabry-Perot filter as an integral part of the laser cavity. Using this technology, these systems are capable of capturing a variety of gases in the any of the well-known spectroscopic scan bands, such as the OH, NH or CH. For example, a single laser with a 250 nm scan band window between 1550-1800 nm can capture ten or as many as twenty hydrocarbon-based gases simultaneously.

Claims (20)

1. An integrated optical analysis system, the system comprising: a hermetic package with at least one optical port through which an optical beam is coupled from an inside of the hermetic package to a sample, wherein the at least one optical port comprises a window that is transparent to the tunable optical signal and functions as part of an outer wall of the hermetic package; a port heat source for heating the at least one optical port; an optical bench within the hermetic package; a tunable source on the optical bench for generating the optical beam that is scanned in wavelength over a scan band; a signal detector on the bench and in the hermetic package for detecting the optical beam received in through the at least one optical port from the sample; and a battery for powering a controller and the tunable source.

2. The system as claimed in claim 1 , wherein the port heat source is a thermoelectric cooler for controlling a temperature of an optical system in the hermetic package.

3. The system as claimed in claim 1 , further comprising a mirror for coupling the optical beam between the at least one optical port and a sample and back to the hermetic package.

4. The system as claimed in claim 3 , wherein the sample is located outside of the hermetic package.

5. The system as claimed in claim 3 , further comprising a mirror heat source for heating the mirror.

6. The system as claimed in claim 5 , wherein the mirror heat source is electronics for operating the integrated optical analysis system.

7. The system as claimed in claim 6 , wherein the mirror heat source heats the mirror to a temperature greater than the surrounding environment to prevent condensation on the mirror during operation.

8. The system as claimed in claim 1 , further comprising a thermally insulating layer that separates the hermetic package from a thermal sink.

9. The system as claimed in claim 1 , wherein the port heat source heats the at least one optical port during operation of the integrated optical analysis system.

10. The system as claimed in claim 1 , further comprising a thermal dissipation path through the hermetic package to a lid of the hermetic package.

11. The system as claimed in claim 1 , further comprising a wavelength detector to provide wavelength calibration reference for a wavelength scanning output laser signal.

12. The system as claimed in claim 1 , wherein the window is a bandpass filter that is limited to the scan band of the system.

13. The system as claimed in claim 1 , wherein the tunable source is a single-chip tunable laser having a scan band of 200-300 nanometers.

14. The system as claimed in claim 1 , wherein the tunable source comprises a gain chip and a Fabry-Perot tunable filter for filtering an emission from the gain chip.

15. The system as claimed in claim 1 , wherein the tunable source is a tunable laser having a scan band of 150 nanometers to 250 nanometers.

16. The system as claimed in claim 1 , wherein the tunable source is a tunable laser having a scan band greater than 400 nanometers.

17. The system as claimed in claim 1 , further comprising a wireless interface that provides wireless communication of analysis information from the controller to a host system.

18. The system as claimed in claim 1 , wherein the port heat source is energized when the tunable source is generating the optical beam.

19. The system as claimed in claim 1 , wherein the port heat source is a resistive heater.

20. An integrated optical analysis system, the system comprising: a hermetic package with at least one optical port through which an optical beam is coupled from an inside of the hermetic package; and an optical bench within the hermetic package; a tunable source on the optical bench for generating the optical beam that is scanned in wavelength over a scan band; a signal detector on the bench and in the hermetic package for detecting the optical beam received in through the at least one optical port from the sample; a controller that monitors the response of the signal detector and generates analysis information; a battery for powering the controller and the tunable source; and a wireless interface that provides wireless communication of the analysis information from the controller to a host system.

Assignments (7)
RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Aug 12, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: AXSUN TECHNOLOGIES, INC.
Reel/Frame 061161/0854 →
RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Aug 12, 2022
From: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
To: AXSUN TECHNOLOGIES, INC.
Reel/Frame 061161/0942 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2020
From: AXSUN TECHNOLOGIES INC.
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 054698/0911 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Jan 2, 2019
From: AXSUN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 048000/0692 →
SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Jan 2, 2019
From: AXSUN TECHNOLOGIES, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 048000/0711 →
CHANGE OF NAME Recorded Aug 31, 2017
From: AXSUN TECHNOLOGIES, LLC
To: AXSUN TECHNOLOGIES, INC.
Reel/Frame 043733/0195 →
CHANGE OF NAME Recorded Feb 24, 2016
From: AXSUN TECHNOLOGIES, INC.
To: AXSUN TECHNOLOGIES LLC
Reel/Frame 037901/0152 →