Light-emitting device package and method of manufacturing the same

1. A light-emitting device package, comprising:

a lead frame formed on a supporting member;

a structure having a cavity exposing a portion of the lead frame and disposed at an opposite side of the lead frame with respect to the supporting member;

a light-emitting device chip mounted on the exposed portion of the lead frame;

at least one through hole penetrating through the supporting member and the lead frame; and

an encapsulation material substantially horizontally filled in the cavity,

wherein the encapsulation material fills a portion of the at least one through hole.

2. The light-emitting device package of claim 1 , wherein the structure is a mold formed of a synthetic resin material.

3. The light-emitting device package of claim 1 , wherein the encapsulation material fills only a portion of the at least one through hole.

4. The light-emitting device package of claim 1 , wherein the encapsulation material is filled in the cavity of the structure to extend above the surface of the lead frame to a height that does not exceed the height of the structure extending above the surface of the lead frame.

5. The light-emitting device package of claim 1 , wherein the encapsulation material is tilled in the cavity of the structure to extend above the surface of the lead frame to a height substantially equal to the height of the structure extending above the surface of the lead frame.

6. The light-emitting device package of claim 1 , wherein the at least one through hole has a diameter selected such that the encapsulation material remains inside the at least one through hole even when the encapsulation material shrinks during manufacturing of the light-emitting device package.

7. The light-emitting device package of claim 1 , wherein:

the supporting member includes a cavity overlapping the at least one through hole,

a width of the cavity of the supporting member is greater than a width of the at least one through, and

the cavity of the supporting member contains no encapsulation material.

8. A method of manufacturing a light-emitting device package, the method comprising:

preparing a package main body comprising a plurality of cavities, wherein a light-emitting device chip is mounted in each of the cavities, wherein a through hole is formed in a bottom of the cavity;

preparing a fixed mold providing a first surface that blocks the cavity;

coupling the package main body to the fixed mold such that an end portion of the cavity contacts the first surface;

supplying an encapsulation material into the cavity through the through hole;

hardening the encapsulation material; and

separating the package main body from the fixed mold, and dicing the package main body into a plurality of the light-emitting device package using a singulation operation,

wherein the encapsulation material is supplied while disposing the package main body on the fixed mold so that the encapsulation material is supplied in a gravitational direction.

9. The method of claim 8 , wherein the encapsulation material is supplied to fill the cavity and at least a portion of the through hole.

10. The method of claim 9 , wherein an amount of the encapsulation material in the through hole is reduced in a gravitational direction when the encapsulation material shrinks during hardening.

11. The method of claim 10 , wherein a diameter of the through hole is designed such that the encapsulation material still remains inside the through hole when the encapsulation material shrinks.

12. The method of claim 10 , wherein a plurality of through holes are formed in the cavity.

13. The method of claim 8 , wherein the first surface is a flat surface.

14. A method of manufacturing a light-emitting device package, the method comprising:

preparing a substrate comprising a plurality of light-emitting device chips mounted on a surface of the substrate, and a plurality of dams surrounding the plurality of light-emitting device chips, wherein a through hole is formed in a bottom of a cavity formed by the plurality of dams;

preparing a fixed mold providing a first surface that blocks end portions of the plurality of dams to define space of the cavity;

coupling the substrate to the fixed mold such that the end portions of the plurality of the dams contacts the first surface;

supplying an encapsulation material into the cavity through the through hole;

hardening the encapsulation material; and

separating the substrate from the fixed mold, and dicing the substrate into a plurality of light-emitting device packages using a singulation operation,

wherein the encapsulation material is supplied while disposing the substrate on the fixed mold such that the encapsulation material is supplied in a gravitational direction.

15. The method of claim 14 , wherein a groove to accommodate the dams is formed in the fixed mold, and a bottom of the groove comprises the first surface of the fixed mold.

16. The method of claim 15 , wherein the encapsulation material is supplied to fill the cavity and at least a portion of the through hole.

17. The method of claim 16 , wherein an amount of the encapsulation material in the through hole is reduced in a gravitational direction when the encapsulation material shrinks during hardening.

18. The method of claim 17 , wherein a diameter of the through hole is designed such that the encapsulation material remains inside the through hole when the encapsulation material shrinks.

19. The method of claim 17 , wherein a plurality of through holes are formed in the cavity.

20. The method of claim 14 , wherein the first surface is a flat surface.