Low-cost transceiver approach
View Patent ↗A transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled with the CMOS chip may be operable to communicate optical source signals from the plurality of semiconductor lasers into the CMOS chip. The source signals may be used to generate first optical signals that may be transmitted from the CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals for use by the CMOS chip. The optical source signals may be communicated from the semiconductor lasers into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.
1. A communication system comprising:
a transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled with said CMOS chip;
wherein said plurality of semiconductor lasers communicate optical source signals into said CMOS chip, said optical source signals for generating first optical signals that are transmitted from said CMOS chip to optical fibers coupled to said CMOS chip; and
wherein second optical signals are received from optical fibers and converted to electrical signals for use by said CMOS chip.
2. The communication system according to claim 1 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.
3. The communication system according to claim 1 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators.
4. The communication system according to claim 1 , wherein said transceiver is operable to convert said second optical signals to electrical signals utilizing one or more photodetectors.
5. The communication system according to claim 1 , wherein said one or more photodetectors are integrated in said CMOS chip.
6. The communication system according to claim 1 , wherein said one or more photodetectors are mounted on said CMOS chip.
7. The communication system according to claim 1 , wherein said plurality of semiconductor lasers comprise vertical cavity surface-emitting lasers.
8. The communication system according to claim 1 , wherein said transceiver is operable to communicate said optical source signals from said plurality of semiconductor lasers into said CMOS chip via one or more optical fibers.
9. The communication system according to claim 1 , wherein said transceiver is operable to receive said optical source signals directly from said plurality of semiconductor lasers into a surface of said CMOS chip.
10. The communication system according to claim 1 , wherein said transceiver is operable to communicate said first optical signals out of a top surface of said CMOS chip.
11. The communication system according to claim 1 , wherein said transceiver is operable to receive said optical source signals into said CMOS chip via one or more optical couplers.
12. The communication system according to claim 11 , wherein said one or more optical couplers comprise grating couplers.
13. The communication system according to claim 1 , wherein said transceiver is operable to communicate said first optical signals from said CMOS chip via one or more optical couplers.
14. The communication system according to claim 13 , wherein said one or more optical couplers comprise grating couplers.
15. A method for communicating signals, the method comprising:
in a transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled to said CMOS chip:
communicating optical source signals from said plurality of semiconductor lasers into said CMOS chip;
generating, using said optical source signals, first optical signals;
transmitting said first optical signals from said CMOS chip to optical fibers coupled to said CMOS chip;
receiving second optical signals from optical fibers; and
converting said second optical signals to electrical signals for use by said CMOS chip.
16. The method according to claim 15 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.
17. The method according to claim 15 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators.
18. The method according to claim 15 , comprising converting said second optical signals to electrical signals via one or more photodetectors.
19. The method according to claim 18 , wherein said one or more photodetectors are integrated in said CMOS chip.
20. The method according to claim 15 , wherein said one or more photodetectors are mounted on said CMOS chip.
21. The method according to claim 15 , wherein said plurality of semiconductor lasers comprise vertical cavity surface-emitting lasers.
22. The method according to claim 15 , comprising communicating said optical source signals from said plurality of semiconductor lasers into said CMOS chip via one or more optical fibers.
23. The method according to claim 15 , comprising communicating said optical source signals into a surface of said CMOS chip.
24. The method according to claim 15 , comprising communicating said first optical signals out of a surface of said CMOS chip.
25. The method according to claim 15 , comprising communicating said optical source signals into said CMOS chip via one or more optical couplers.
26. The method according to claim 25 , wherein said one or more optical couplers comprise grating couplers.
27. The method according to claim 15 , comprising communicating said first optical signals from said CMOS chip via one or more optical couplers.
28. The method according to claim 27 , wherein said one or more optical couplers comprise grating couplers.
29. A communication system comprising:
a CMOS chip, and a plurality of semiconductor lasers coupled with said CMOS chip;
wherein said plurality of semiconductor lasers communicate optical source signals into said CMOS chip, said optical source signals for generation of first optical signals that are transmitted from said CMOS chip to optical fibers coupled to said CMOS chip; and
wherein second optical signals are received from said optical fibers and converted to electrical signals for use by said CMOS chip.
30. The system of claim 29 , wherein said first optical signals are communicated out of, and said optical source signals and said second optical signals are communicated into, a surface of said CMOS chip facing said plurality of semiconductor lasers.
31. The system according to claim 29 , wherein said CMOS chip is operable to convert said second optical signals to electrical signals via one or more photodetectors.
32. The system according to claim 31 , wherein said one or more photodetectors are integrated in said CMOS chip.
33. The system according to claim 31 , wherein said one or more photodetectors are mounted on said CMOS chip.
34. The system according to claim 29 , wherein said plurality of semiconductor lasers are operable to communicate said source optical signals into said CMOS chip via grating couplers integrated in said CMOS chip.
35. The system according to claim 29 , wherein said CMOS chip is operable to transmit said first optical signals from said CMOS chip via grating couplers integrated in said CMOS chip.
36. A system for two-way communication of optical signals comprising:
a CMOS chip and a plurality of semiconductor lasers; wherein:
optical source signals are communicated into said CMOS chip utilizing said plurality of semiconductor lasers;
optical signals representative of electronic signals received from the electronic circuitry of said CMOS chip are communicated from said CMOS chip over one or more optical fibers coupled to said CMOS chip; and
electronic signals representative of optical signals received over one or more optical fibers coupled to said CMOS chip are communicated to electronic circuitry of said CMOS chip.
37. The communication system according to claim 36 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.
38. The communication system according to claim 36 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators.
39. The communication system according to claim 36 , wherein said CMOS chip is operable to generate said electronic signals representative of received optical signals utilizing one or more photodetectors.
40. The communication system according to claim 39 , wherein said one or more photodetectors are integrated in said CMOS chip.
41. The communication system according to claim 39 , wherein said one or more photodetectors are mounted on said CMOS chip.
42. The communication system according to claim 36 , wherein said plurality of semiconductor lasers comprise vertical cavity surface-emitting lasers.
43. The communication system according to claim 36 , wherein said optical source signals are communicated from said plurality of semiconductor lasers into said CMOS chip via one or more optical fibers.
44. The communication system according to claim 36 , wherein said optical source signals are communicated into a top surface of said CMOS chip.
45. The communication system according to claim 36 , wherein said first optical signals are communicated out of a top surface of said CMOS chip.
46. The communication system according to claim 36 , wherein said optical source signals are communicated into said CMOS chip via one or more optical couplers.
47. The communication system according to claim 46 , wherein said one or more optical couplers comprise grating couplers.
48. The communication system according to claim 36 , wherein said first optical signals are communicated from said CMOS chip via one or more optical couplers.
49. The communication system according to claim 48 , wherein said one or more optical couplers comprise grating couplers.
50. A method for communicating signals, the method comprising:
in a transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled with said CMOS chip:
communicating optical source signals into said CMOS chip utilizing said plurality of semiconductor lasers;
generating first optical signals in said CMOS chip based on said optical source signals;
transmitting said first optical signals from said CMOS chip to optical fibers coupled to said CMOS chip; and
receiving second optical signals from optical fibers and converting said second optical signals to electrical signals for use by said CMOS chip.
51. The method according to claim 50 , comprising communicating said optical source signals and receiving said second optical signals into, and transmitting said first optical signals out of, a top surface of said CMOS chip.
52. The method according to claim 50 , comprising converting said second optical signals to electrical signals utilizing one or more photodetectors.
53. The method according to claim 52 , wherein said one or more photodetectors are integrated in said CMOS chip.
54. The method according to claim 52 , wherein said one or more photodetectors are mounted on said CMOS chip.
55. The method according to claim 50 , wherein said CMOS chip comprises optical and electronic devices.
56. The method according to claim 50 , comprising communicating said optical source signals into said CMOS chip via grating couplers.
57. The method according to claim 50 , comprising transmitting said first optical signals from said CMOS chip via grating couplers.