IP Library Granted Patent US 8,670,213
Granted Patent B1
US 8,670,213 · App. 13/422,997 · Granted Mar 11, 2014

Methods for tunable plating seed step coverage

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Quick Facts
Patent No.
US 8,670,213
App. No.
13/422,997
Granted
Mar 11, 2014
Kind
B1
Abstract

A writer main pole for a perpendicular magnetic recording system is provided. The writer pole has a tunable bottom gap to side gap ratio, and may be formed using deposition of a first seed layer through an ion beam deposition process, deposition of a second seed layer through a physical vapor deposition process, and deposition of a non-magnetic gap layer through a chemical vapor deposition process.

Claims (29)

1. A method, comprising:

ion beam depositing a seed layer over the bottom and sides of a trench formed in an insulating material over a substrate,

the ion beam depositing using a predetermined ion beam deposition angle such that the seed layer has a different thickness over the bottom of the trench than over the sides of the trench;

chemical vapor depositing a non-magnetic gap layer over the seed layer; and

physical vapor depositing a second seed layer on the first seed layer;

wherein the non-magnetic gap layer is deposited on the second seed layer.

2. The method of claim 1 , wherein the physical vapor deposition of the second seed layer is performed at a sufficient pressure such that the second seed layer is amorphous or has grain sizes below 5 nm.

3. The method of claim 1 , wherein the second seed layer comprises at least one of tantalum, titanium, aluminum, or chromium and at least one of ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, or gold.

4. The method of claim 1 , wherein the second seed layer comprises an application of between 1.5 and 2.5 nm of tantalum and between 5 and 7.5 nm of ruthenium.

5. The method of claim 1 , wherein the seed layer comprises at least one of tantalum, titanium, chromium, or aluminum and at least one of ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, or gold.

6. The method of claim 1 , wherein the seed layer comprises an application of between 1.5 and 2.5 nm of tantalum and between 15 and 30 nm of ruthenium.

7. The method of claim 1 , wherein the non-magnetic gap layer comprises ruthenium.

8. The method of claim 1 , further comprising depositing a soft magnetic shield layer on the non-magnetic gap layer.

9. The method of claim 8 , wherein the soft magnetic shield layer comprises a nickel-iron, nickel-iron-cobalt, iron-cobalt based soft magnetic material.

10. A method, comprising:

ion beam depositing a seed layer over the bottom and sides of a trench formed in an insulating material over a substrate,

the ion beam depositing using a predetermined ion beam deposition angle such that the seed layer has a different thickness over the bottom of the trench than over the sides of the trench; and

chemical vapor depositing a non-magnetic gap layer over the seed layer;

wherein the predetermined ion beam deposition angle is configured to provide a predetermined ratio of bottom gap thickness to side gap thickness.

11. The method of claim 10 , wherein the predetermined ion beam deposition angle is between 23° and 53°.

12. A perpendicular magnetic recording writer main pole created by a process, the process comprising:

ion beam depositing a first seed layer over the bottom and sides of a trench formed in an insulating material over a substrate,

the ion beam depositing using a predetermined ion beam deposition angle such that the seed layer has a different thickness over the bottom of the trench than over the sides of the trench;

physical vapor depositing a second seed layer on the first seed layer; and

chemical vapor depositing a non-magnetic gap layer on the second seed layer.

13. The perpendicular magnetic recording writer main pole of claim 12 , wherein:

the first seed layer comprises an application of between 1.5 and 2.5 nm of tantalum and between 15 and 30 nm of ruthenium;

wherein the second seed layer comprises an application of between 1.5 and 2.5 nm of tantalum and between 5 and 7.5 nm of ruthenium; and

the non-magnetic gap layer comprises ruthenium.

Assignments (8)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0845 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL (FREMONT), LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: WESTERN DIGITAL (FREMONT), LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050450/0582 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 045501/0158 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038710/0845 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0675 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0755 →