IP Library Granted Patent US 8,735,924
Granted Patent B2
US 8,735,924 · App. 13/423,015 · Granted May 27, 2014

Group III nitride semiconductor light-emitting device

Inventors: Shingo Totani (Kiyosu, JP); Kosuke Yahata (Kiyosu, JP); Yuya Ishiguro (Kiyosu, JP)
Assignee: Toyoda Gosei Co., Ltd.
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Quick Facts
Patent No.
US 8,735,924
App. No.
13/423,015
Granted
May 27, 2014
Kind
B2
Abstract

A Group III nitride semiconductor light-emitting device having an Ag or Ag alloy reflective film provided in an insulating film, at least a portion of the reflective film is located via the insulating film in a region between an n-lead electrode and at least one of a p-contact electrode having transparency and a p-type layer, wherein a conductive film is formed via the insulating film between the n-lead electrode and the reflective film of the region, and the conductive film is electrically connected to at least one of the p-contact electrode and the p-type layer.

Claims (26)

1. A Group III nitride semiconductor light-emitting device, comprising:

an n-type layer;

a p-type layer formed above the n-type layer; and

an Ag or an Ag alloy reflective film provided in an insulating film, at least a portion of the reflective film being located via the insulating film in a region between an n-lead electrode and at least one of a p-contact electrode having transparency and the p-type layer,

wherein a conductive film is formed via the insulating film between the n-lead electrode and the reflective film of the region, and the conductive film is electrically connected to at least one of the p-contact electrode and the p-type layer, and

wherein the reflective film is electrically isolated from the n-lead electrode by the insulating film, and with the n-lead electrode electrically insulated from the reflective film and the conductive film, the n-lead electrode passes through the reflective film and the conductive film, and is electrically connected to the n-type layer.

2. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the p-contact electrode comprises an ITO electrode.

3. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the p-contact electrode comprises an intermediate electrode, and the conductive film is connected to the p-contact electrode via the intermediate electrode.

4. A Group III nitride semiconductor light-emitting device according to claim 2 , wherein the p-contact electrode comprises an intermediate electrode, and the conductive film is connected to the p-contact electrode via the intermediate electrode.

5. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the n-lead electrode on a plane view.

6. A Group III nitride semiconductor light-emitting device according to claim 2 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the n-lead electrode on a plane view.

7. A Group III nitride semiconductor light-emitting device according to claim 3 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the n-lead electrode on a plane view.

8. A Group III nitride semiconductor light-emitting device according to claim 4 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the n-lead electrode on a plane view.

9. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the reflective film on a plane view.

10. A Group III nitride semiconductor light-emitting device according to claim 2 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the reflective film on a plane view.

11. A Group III nitride semiconductor light-emitting device according to claim 3 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the reflective film on a plane view.

12. A Group III nitride semiconductor light-emitting device according to claim 4 , wherein the conductive film is formed in a same or larger than an area including an orthogonal projection of the reflective film on a plane view.

13. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein a p-lead electrode is provided for connecting to at least one of the p-contact electrode and the p-type layer, and the conductive film is connected to at least one of the p-contact electrode and the p-type layer via the p-lead electrode by connecting the conductive film to the p-lead electrode.

14. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein a p-lead electrode is provided for connecting to at least one of the p-contact electrode and the p-type layer, and the conductive film is connected to at least one of the p-contact electrode and the p-type layer via the p-lead electrode by connecting the conductive film to the p-lead electrode.

15. A Group III nitride semiconductor light-emitting device according to claim 5 , wherein a p-lead electrode is provided for connecting to at least one of the p-contact electrode and the p-type layer, and the conductive film is connected to at least one of the p-contact electrode and the p-type layer via the p-lead electrode by connecting the conductive film to the p-lead electrode.

16. A Group III nitride semiconductor light-emitting device according to claim 9 , wherein a p-lead electrode is provided for connecting to at least one of the p-contact electrode and the p-type layer, and the conductive film is connected to at least one of the p-contact electrode and the p-type layer via the p-lead electrode by connecting the conductive film to the p-lead electrode.

17. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the conductive film comprises at least one of Al, Ti, Cr, and ITO.

18. A Group III nitride semiconductor light-emitting device according to claim 5 , wherein the conductive film comprises at least one of Al, Ti, Cr, and ITO.

19. A Group III nitride semiconductor light-emitting device according to claim 9 , wherein the conductive film comprises at least one of Al, Ti, Cr, and ITO.

20. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the light-emitting device comprises a flip-chip type.

21. A Group III nitride semiconductor light-emitting device according to claim 1 , wherein the reflective film is enclosed in the insulating film.

Assignments (2)
SECURITY AGREEMENT Recorded Jun 28, 2013
From: OXANE MATERIALS, INC.
To: COMERICA BANK
Reel/Frame 030707/0501 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2012
From: TOTANI, SHINGO; YAHATA, KOSUKE; ISHIGURO, YUYA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 028009/0042 →
Priority Claims (2)
JP 2011-061858 · Mar 21, 2011 · national
JP 2011-231453 · Oct 21, 2011 · national
Continuity (1)
Related Publication 20120241791A1 · Sep 27, 2012