Chip identification pads for identification of integrated circuits in an assembly
View Patent ↗Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical connection pattern. The electrical connection pattern of each set is distinct from the electrical connection pattern on every other set. Each distinct electrical connection pattern represents a unique identifier of the corresponding IC thereby enabling the controller to distinguish between the ICs.
1. A printed circuit board assembly (PCBA) comprising:
a controller;
a plurality of integrated circuits (ICs);
a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs;
a set of one or more chip identification pads formed on each IC, each set of chip identification pads having an electrical connection pattern that is independent of the controller, the electrical connection pattern of each set being distinct from the electrical connection pattern on every other set, each distinct electrical connection pattern representing a unique identifier of the corresponding IC thereby enabling the ICs to self-identify to the controller and enabling the controller to distinguish between the ICs.
2. The PCBA as recited in claim 1 , wherein the electrical connection pattern is created by electrically placing each chip identification pad in one of two binary states.
3. The PCBA as recited in claim 1 , wherein the two binary states are created by connecting each chip identification pad to a known voltage or leaving each chip identification pad unconnected.
4. The PCBA as recited in claim 1 , further comprising a memory formed on each IC, and each IC is configured to store the unique identifier in its memory upon initialization of the IC.
5. The PCBA as recited in claim 4 , wherein when the controller attempts to communicate with a target IC, the controller is configured to read the unique identifier from the memory to determine if the corresponding IC is the target IC.
6. The PCBA as recited in claim 1 , wherein each IC is configured to function as multiple laser drivers for multiple lasers.
7. The PCBA as recited in claim 6 , wherein each IC is configured to function as four laser drivers for four vertical cavity surface emitting lasers (VCSELS).
8. The PCBA as recited in claim 1 , wherein each IC is configured to function as multiple transimpedance amplifiers for multiple photodiodes.
9. The PCBA as recited in claim 8 , wherein each IC is configured to function as four transimpedance amplifiers for four p-type, intrinsic, n-type (“PIN”) photodiodes.
10. A parallel optoelectronic module comprising:
a plurality of transducers;
a controller;
a plurality of ICs electrically connected to the plurality of transducers;
a shared communication bus that connects the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs; and
a set of one or more chip identification pads formed on each IC, each set of chip identification pads having an electrical connection pattern that is independent of the controller, the electrical connection pattern of each set being distinct from the electrical connection pattern on every other set, each distinct electrical connection pattern representing a unique identifier of the corresponding IC thereby enabling the ICs to self-identify to the controller and enabling the controller to distinguish between the ICs.
11. The parallel optoelectronic module as recited in claim 10 , wherein the electrical connection pattern is created by electrically placing each chip identification pad in one of two binary states.
12. The parallel optoelectronic module as recited in claim 11 , wherein the two binary states are created by connecting each chip identification pad to a known voltage or leaving each chip identification pad unconnected.
13. The parallel optoelectronic module as recited in claim 12 , wherein the known voltage is electrical ground.
14. The parallel optoelectronic module as recited in claim 10 , further comprising a memory formed on each IC, and each memory is configured to store the unique identifier upon initialization of the corresponding IC such that when the controller attempts to communicate with a target IC, the controller is configured to read the unique identifier from the memory to determine if the corresponding IC is the target IC.
15. The parallel optoelectronic module as recited in claim 10 , wherein each IC is configured to function as four transimpedance amplifiers or four laser drivers.
16. A parallel active optical cable comprising:
a fiber-optic communications cable comprising one or more optical data transmission lines, the fiber-optic communications cable having first and second ends; and
first and second parallel optoelectronic transceiver modules attached to the first and second ends of the fiber-optic communications cable, respectively, each parallel optoelectronic transceiver module comprising:
a plurality of lasers;
a plurality of photodiodes;
a transmitter controller;
a receiver controller;
a plurality of laser driver ICs electrically connected to the plurality of lasers;
a plurality of transimpedance amplifier ICs electrically connected to the plurality of photodiodes;
a shared transmitter communication bus that connects the transmitter controller to the plurality of laser drivers ICs and configured to enable communication between the transmitter controller and each of the plurality of laser drivers ICs;
a shared receiver communication bus that connects the receiver controller to the plurality of transimpedance amplifier ICs and configured to enable communication between the receiver controller and each of the plurality of transimpedance amplifier ICs;
a memory formed on each IC; and
a set of one or more chip identification pads formed on each IC, each set of chip identification pads having an electrical connection pattern that is independent of the corresponding controller, the electrical connection pattern of each laser driver IC being distinct from the electrical connection pattern on every other laser driver IC, the electrical connection pattern of each transimpedance amplifier IC being distinct from the electrical connection pattern on every other transimpedance amplifier IC, each distinct electrical connection pattern representing a unique identifier of the corresponding IC thereby enabling each IC to self-identify to the corresponding controller and enabling the corresponding controller to distinguish between the ICs.
17. The parallel active optical cable as recited in claim 16 , wherein the electrical connection pattern is created by electrically placing each chip identification pad in one of two binary states.
18. The parallel active optical cable as recited in claim 17 , wherein the two binary states are created by connecting each chip identification pad to a known voltage or leaving each chip identification pad unconnected.
19. The parallel active optical cable as recited in claim 18 , wherein the known voltage is electrical ground.
20. The parallel active optical cable as recited in claim 16 , wherein each memory is configured to store the unique identifier upon initialization of the corresponding IC such that when the corresponding controller attempts to communicate with a target IC, the controller is configured to read the unique identifier from the memory to determine if the corresponding IC is the target IC.