Optoelectronic module
The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
1. An optoelectronic module, comprising:
a first substrate, having a top surface, a bottom surface, a concave structure, wherein said top surface is opposite to said bottom surface, and said concave structure is formed on said top surface;
an optoelectronic device, disposed in said concave structure, wherein said optoelectronic device is capable of emitting or receiving an optical signal;
a light-guiding structure configured on said top surface of said first substrate;
an upper structure disposed above said first substrate and combining with said first substrate to fix said light-guiding structure, wherein said upper structure has a reflection surface capable of transmitting said optical signal between said optoelectronic device and said light-guiding structure;
a first through hole structure, wherein an aspect ratio of the first through hole structure is 0.3:1 to larger than 20:1, and said aspect ratio is a ratio of depth of said first through hole structure to a diameter of a through hole opening of said first through hole structure;
a first conductive material, filled into said first through hole structure; and
a control unit, coupled to said first conductive material and said optoelectronic device for controlling said optoelectronic device.
2. The optoelectronic module of claim 1 , wherein said first through hole structure is formed in said first substrate and passes through from bottom surface of said concave structure to said bottom surface of said first substrate.
3. The optoelectronic module of claim 1 , further comprising a second through hole structure and a second conductive material, wherein said second through hole structure is formed in said first substrate and passes through said first substrate from bottom surface of said concave structure to said bottom surface of said first substrate, said second conductive material is filled into said second through hole structure, said first conductive material is connected to said control unit, and said second conductive structure is connected to said optoelectronic device.
4. The optoelectronic module of claim 1 , further comprising a print circuit board located under said first substrate and coupled to said first conductive material and said second conductive material.
5. The optoelectronic module of claim 1 , wherein the aspect ratio of the first through hole structure is from 4:1 to 15:1.
6. The optoelectronic module of claim 1 , wherein the depth of the first through hole structure is 20-500 micron.
7. The optoelectronic module of claim 1 , wherein a diameter of a through-hole opening of the first through hole structure is 20-200 micron.
8. The optoelectronic module of claim 1 , wherein the control unit is disposed on a first surface and the optoelectronic device is disposed on a second surface, and the first surface is not higher than the second surface.
9. The optoelectronic module of claim 8 , wherein the first surface is the same as the second surface.