Solar cell having an emitter region with wide bandgap semiconductor material
View Patent ↗Solar cells having emitter regions composed of wide bandgap semiconductor material are described. In an example, a method includes forming, in a process tool having a controlled atmosphere, a thin dielectric layer on a surface of a semiconductor substrate of the solar cell. The semiconductor substrate has a bandgap. Without removing the semiconductor substrate from the controlled atmosphere of the process tool, a semiconductor layer is formed on the thin dielectric layer. The semiconductor layer has a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate.
1. A method of fabricating a solar cell, the method comprising:
forming, in a process tool having a controlled atmosphere, a thin dielectric layer of aluminum oxide (Al2O3) on a surface of a single crystalline N-type silicon semiconductor substrate of the solar cell, the semiconductor substrate having a bandgap; and, without removing the semiconductor substrate from the controlled atmosphere of the process tool,
forming a semiconductor layer on the thin dielectric layer, the semiconductor layer being transparent in the visible spectrum and having a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate and a bandgap of greater than 3 eV and comprising a material selected from the group consisting of: aluminum nitride (AIN), aluminum gallium nitride (AlxGa1-xN, where 0<x<1), and boron nitride (BN).
2. A method of fabricating a solar cell, the method comprising:
forming a first emitter region on a surface of a N-type silicon semiconductor substrate of the solar cell, the first emitter region comprising a semiconductor material doped to a first conductivity type and formed on a first thin dielectric layer; and
forming a second emitter region on the surface of the semiconductor substrate, the forming comprising:
forming, in a process tool having a controlled atmosphere, a thin dielectric layer of aluminum oxide (Al2O3) on a surface of a single crystalline N-type silicon semiconductor substrate of the solar cell, the semiconductor substrate having a bandgap; and, without removing the semiconductor substrate from the controlled atmosphere of the process tool,
forming a semiconductor layer on the thin dielectric layer, the semiconductor layer being transparent in the visible spectrum and having a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate and a bandgap of greater than 3 eV and comprising a material selected from the group consisting of: aluminum nitride (AIN), aluminum gallium nitride (AlxGa1-xN, where 0 <x<1), and boron nitride (BN); and
doping the semiconductor layer with charge carrier dopant impurity ions of a second, opposite conductivity type.
3. The method of claim 1 , further comprising:
forming an emitter region for the solar cell from the semiconductor layer.
4. The method of claim 1 , further comprising:
doping the semiconductor layer with charge carrier dopant impurity atoms having a concentration approximately in the range of 1×10 17 -1×10 21 atoms/cm 3 .
5. The method of claim 4 , wherein the doping is performed in situ during the forming of the semiconductor layer.
6. The method of claim 4 , wherein the doping is performed subsequent to the forming of the semiconductor layer.
7. The method of claim 1 , wherein forming the thin dielectric layer on the surface of the semiconductor substrate comprises consuming a portion of the semiconductor substrate by thermal oxidation.
8. The method of claim 1 , wherein forming the thin dielectric layer and the semiconductor layer in the process tool comprises using a low pressure chemical vapor deposition (LPCVD) chamber, a rapid thermal anneal (RTA) chamber, a rapid thermal processing (RTP) chamber, an atmospheric pressure chemical vapor deposition (APCVD) chamber, a hydride vapor phase epitaxy (HVPE) chamber, or both of an RTP chamber and a plasma enhanced chemical vapor deposition (PECVD) chamber.
9. The method of claim 1 , further comprising:
texturizing the surface of the semiconductor substrate prior to forming the thin dielectric layer.
10. The method of claim 1 , wherein forming the thin dielectric layer and the semiconductor layer on the surface of the semiconductor substrate comprises forming on a back-contact surface of the semiconductor substrate, the forming further comprising forming the thin dielectric layer and the semiconductor layer on a light-receiving surface of the semiconductor substrate.
11. The method of claim 2 , further comprising:
texturizing the surface of the semiconductor substrate prior to forming the second thin dielectric layer.