Electronics package suitable for implantation
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
1. An implantable device comprising:
a first substrate forming part of a rigid hermetic package, containing a first electrically conductive pad on a first side of said first substrate electrically connected to hermetic vias through the first substrate;
a first flexible electrically insulating layer on said first side of said substrate;
a flexible electrically conducting layer on said first flexible electrically insulating layer wherein at least a portion of said flexible electrically conducting layer electrically contacts said first conductive pad;
a second flexible electrically insulating layer on said flexible electrically conducting layer and said first flexible electrically insulating layer;
a second substrate containing a second conductive pad on a first side of said second substrate,
wherein the second conductive pad electrically contacts at least a portion of said flexible electrically conducting layer.
2. The implantable device according to claim 1 , wherein said first substrate is a rigid substrate.
3. The implantable device according to claim 1 , wherein said second substrate include at least one electrode.
4. The implantable device according to claim 3 , wherein said electrode is a protruding electrode.
5. The implantable device according to claim 1 , further comprising an electrical circuit on said first substrate.
6. The implantable device according to claim 5 , further comprising a hermetic package enclosing said electrical circuit.
7. The implantable device according to claim 1 , wherein said first substrate comprises an integrated circuit.
8. The implantable device according to claim 7 , wherein said integrated circuit is within a hermetic package.
9. The implantable device according to claim 7 , wherein said substrate a hybrid circuit.
10. The implantable device according to claim 1 , further comprising multiple first conductive pads.
11. The implantable device according to claim 1 , further comprising multiple second conductive pads.
12. The implantable device according to claim 1 , further comprising electrically conductive feedthroughs through said first substrate, electrically connected to said first conductive pads.
13. The implantable device according to claim 1 , wherein said implantable device is a neural interface.
14. The implantable device according to claim 1 , wherein said first flexible insulating layer defines a void for electrically connecting said flexible electrical conducting layer to said first electrically conducting pad.