Semiconductor device and fabrication method therefor
A semiconductor device includes: a first substrate on which a first field effect transistor is provided; and a second substrate on which a second field effect transistor of a second conductive type is provided; the first and second substrates being bonded to each other at the substrate faces thereof on which the first and second field transistors are provided, respectively; the first field effect transistor and the second field effect transistor being electrically connected to each other.
1. A semiconductor device wherein in a plan view of a layout, the semiconductor device comprising:
a first gate electrode extending linearly in a first longitudinal direction, said first longitudinal direction in said plan view differing from a second longitudinal direction;
a second gate electrode extending linearly in said second longitudinal direction, said first gate electrode in said plan view crossing said second gate electrode,
wherein said first gate electrode crosses said second gate electrode in said plan view at an angle of 45 degrees, and a crossing portion of said first gate electrode overlaps said a crossing portion of second gate electrode in a vertical direction perpendicular to a plane defined by said first longitudinal direction and said second longitudinal direction.
2. A semiconductor device according to claim 1 , wherein said first longitudinal direction in said plan view crosses said second longitudinal direction.
3. A semiconductor device according to claim 1 , wherein said first longitudinal direction in said plan view is non-orthogonal to said second longitudinal direction.
4. A semiconductor device according to claim 1 , wherein said second gate electrode contains titanium nitride.
5. A semiconductor device according to claim 1 , wherein said first gate electrode contains titanium nitride.
6. A semiconductor device according to claim 5 , wherein said first gate electrode contains aluminum.
7. A semiconductor device according to claim 1 , wherein said first gate electrode is a metal material.
8. A semiconductor device according to claim 7 , wherein said second gate electrode is said metal material.
9. A semiconductor device according to claim 1 , further comprising:
a gate connection configured to electrically connect said first gate electrode to said second gate electrode.
10. A semiconductor device according to claim 9 , wherein said gate connection directly electrically connects said first gate electrode to said second gate electrode.
11. A semiconductor device according to claim 1 , wherein said first gate electrode in said plan view is between a source-drain region of a first conductivity-type and a different source-drain region of the first conductivity-type.
12. A semiconductor device according to claim 11 , further comprising:
a reference voltage terminal electrically connected to said different source-drain region of the first conductivity-type.
13. A semiconductor device according to claim 11 , wherein said second gate electrode in said plan view is between a source-drain region of a second conductivity-type and a different source-drain region of the second conductivity-type.
14. A semiconductor device according to claim 13 , wherein said first conductivity-type is opposite to said second conductivity-type.
15. A semiconductor device according to claim 13 , wherein said source-drain region of the first conductivity-type in said plan view overlaps said source-drain region of the second conductivity-type.
16. A semiconductor device according to claim 13 , wherein said first conductivity-type differs from said second conductivity-type.
17. A semiconductor device according to claim 13 , further comprising:
a supply voltage terminal electrically connected to said different source-drain region of the second conductivity-type.
18. A semiconductor device according to claim 13 , further comprising:
a connection configured to electrically connect said source-drain region of the first conductivity-type to said source-drain region of the second conductivity-type.
19. A semiconductor device according to claim 13 , wherein said source-drain region of the first conductivity-type is in a first semiconductor substrate, said source-drain region of the second conductivity-type being in a second semiconductor substrate.
20. A semiconductor device according to claim 19 , wherein said first gate electrode is on said first semiconductor substrate, said second gate electrode being on said second semiconductor substrate.
21. A semiconductor device according to claim 13 , further comprising:
a channel region of the first conductivity-type between said source-drain region of the second conductivity-type and said different source-drain region of the second conductivity-type.
22. A semiconductor device according to claim 21 , wherein said channel region in said plan view extends linearly in said second longitudinal direction.
23. A semiconductor device according to claim 21 , wherein said channel region crosses said first gate electrode.
24. A semiconductor device according to claim 21 , wherein said channel region in said plan view is in parallel with said second gate electrode.
25. A semiconductor device according to claim 21 , wherein said channel region touches said source-drain region of the second conductivity-type and said different source-drain region of the second conductivity-type.
26. A semiconductor device according to claim 21 , wherein said first gate electrode is between said channel region and said second gate electrode.