CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF
Exemplary embodiments of the disclosure are directed to a circuit arrangement in which a power functional device and a conductor element are mounted and a method of manufacturing the same. The arrangement includes a substrate, a wiring layer provided on the substrate and electrically connected to the functional device and to the conductor element and an intermediate electric contact device. The intermediate electric contact device is mounted on the wiring layer to provide on the side opposite to the wiring layer a contact region for contacting the conductor element. The conductor element is contacting the intermediate electric contact device in the contact region which is opposite to an area, in which the electric contact device is fixed to the wiring layer.
1 . A circuit arrangement comprising:
a substrate;
a wiring layer provided on the substrate and electrically connected to a power functional device and to a conductor element; and
an intermediate contact device, which is mounted on the wiring layer to provide a contact region for contacting the conductor element on a side opposite to the wiring layer,
wherein the intermediate contact device has at least a first side and a second side, the second side is at least substantially parallel to the first side, wherein the intermediate contact device is fixed to the wiring layer on the first side, wherein the conductor element is contacting the intermediate contact device on the second side in the contact region.
2 . The circuit arrangement according to claim 1 , wherein the intermediate contact device is fixed to the wiring layer by at least one of a soldering joint and by a joint made by low-temperature bonding.
3 . The circuit arrangement according to claim 1 , wherein the intermediate electric contact device is fixed to a part of the wiring layer in finite sub areas of an entire outer side of the wiring layer.
4 . The circuit arrangement according to claim 1 , wherein the conductor element is an externally leading conductor or a bonding element leading from the intermediate contact device to the power functional device.
5 . The circuit arrangement according to one of claim 1 , wherein the power functional device is a power semiconductor device.
6 . The circuit arrangement according to claim 1 , wherein the intermediate contact device is at least partially electrically conductible, and wherein the intermediate contact device is one of a metal foil, a metal sheet or a metal plate.
7 . The circuit arrangement according to claim 1 , wherein the at least partially electrically conductible intermediate contact device is a circuit board.
8 . The circuit arrangement according to claim 1 , wherein the intermediate contact device is thicker than 100 μm.
9 . The circuit arrangement according to claim 1 , wherein the intermediate contact device and a bonding element for electrically contacting the power functional device with the wiring layer are integrally formed.
10 . The circuit arrangement according to claim 1 , wherein the intermediate contact device is in direct electrical and mechanical contact to the wiring layer.
11 . The circuit arrangement according to claim 1 , wherein the intermediate contact device is self-contained.
12 . The circuit arrangement according to claim 1 , wherein the contact region is opposite to an area on the first side in which the intermediate contact device is electrically conductively fixed to the wiring layer.
13 . The circuit arrangement according to claim 15 , wherein the power semiconductor device is a power transistor including one of an insulated gate bipolar transistor and a diode.
14 . A method of manufacturing a circuit arrangement, according to claim 1 , in which at least one power functional device and at least one conductor element is mounted, wherein the arrangement includes a substrate and a wiring layer provided on the substrate, the method comprising the steps of:
mounting and electrically contacting an intermediate contact device on the wiring layer to provide a contact region on one side of the intermediate contact device, which is opposite to the wiring layer; and
directly electrically connecting the conductor element to the intermediate contact device in the contact region.
15 . The method according to claim 14 , wherein mounting the intermediate contact element to a part of the wiring layer includes fixing the intermediate contact element to the part only in finite sub-areas of the entire outer side of the wiring layer.
16 . The method according to claim 14 , wherein the intermediate contact device is fixed to the wiring layer by soldering and/or low-temperature bonding.
17 . The method according to claim 14 , wherein the conductor element is an externally leading conductor.
18 . The method according to claim 14 , wherein the power functional device is a power semiconductor.
19 . The method according to claim 14 , wherein the intermediate contact device is at least partial electrically conductible, and wherein the intermediate contact device is one of a metal foil, a metal sheet or a metal plate.
20 . The method according to claim 14 , wherein the intermediate contact device is at least partially electrically conductible, and wherein the intermediate contact device is a circuit board.
21 . The method according to claim 12 , wherein the intermediate contact device and a bonding element for electrically contacting the power functional device with the wiring layer are integrally formed.
22 . The method according to claim 18 , wherein the power semiconductor is a power transistor including one of an insulated gate bipolar transistor and a diode.