Method of manufacturing thin film transistor
View Patent ↗A thin film transistor for an organic light emitting diode includes a substrate including a pixel portion and an interconnection portion, a buffer layer on the substrate, a gate electrode and a gate interconnection on the buffer layer, wherein the gate electrode is located at the pixel portion and the gate interconnection is located at the interconnection portion, a gate insulating layer on the substrate, a semiconductor layer on the gate electrode, source and drain electrodes electrically connected to the semiconductor layer, and a metal pattern on the gate interconnection.
1. A method of manufacturing a thin film transistor, the method comprising:
providing a substrate having a pixel portion and a peripheral portion;
forming a buffer layer on the substrate;
forming a gate electrode and a gate interconnection on the buffer layer, the gate electrode being located at the pixel portion, the gate interconnection being located at the peripheral portion;
forming a gate insulating layer on the gate electrode and the gate interconnection;
forming an amorphous semiconductor layer and patterning the amorphous semiconductor layer to form a semiconductor layer pattern on the gate electrode of the pixel portion;
forming a metal layer on the substrate to be electrically connected to the semiconductor layer pattern and the gate interconnection;
applying an electric field to the metal layer to crystallize the semiconductor layer pattern to form a semiconductor layer; and
patterning the metal layer to form source and drain electrodes electrically connected to the semiconductor layer of the pixel portion and a metal pattern on the gate interconnection.
2. The method of claim 1 , wherein the metal pattern is in direct contact with the gate interconnection.
3. The method of claim 1 , wherein the crystallization is performed by applying the electric field of about 100 V/cm 2 to about 10,000 V/cm 2 to the source/drain electrode metal layer.
4. The method of claim 1 , wherein the metal layer is formed on the substrate to a thickness of about 50 nm to about 200 nm.
5. The method of claim 1 , wherein the metal layer includes at least one of molybdenum, chromium, tungsten, molybdenum-tungsten, aluminum, aluminum-neodymium, titanium, titanium nitride, copper, a molybdenum alloy, an aluminum alloy, and a copper alloy.
6. The method of claim 1 , further comprising forming an impurity-doped silicon layer between the semiconductor layer and the source and drain electrodes.