Semiconductor device and manufacturing method thereof
View Patent ↗A semiconductor device is provided, which includes an annular insulation separation portion penetrating a semiconductor substrate, and an electrode penetrating the semiconductor substrate in a region surrounded by the annular insulation separation portion, wherein the insulation separation portion includes at least a first film that gives compressive stress in a depth direction on the side of a substrate, a second film that gives tensile stress in the depth direction is formed on the first film, and film thicknesses of the first and second films are adjusted so that the compressive stress and the tensile stress are almost balanced.
1. A method of manufacturing a semiconductor device comprising:
forming a trench on a main surface of a semiconductor substrate;
thermally oxidizing silicon to form a first silicon oxide film in the trench;
depositing a second silicon oxide film on the main surface of the semiconductor substrate; and
reducing a thickness of the semiconductor substrate from a back surface that is located on a opposite side of the main surface to expose a bottom of the trench, wherein:
the first silicon oxide film gives a compressive stress to the semiconductor substrate in a depth direction;
the second silicon oxide film gives a tensile stress to the semiconductor substrate in the depth direction; and
the second silicon oxide film has the film thickness so that the tensile stress is substantially balanced out by the compressive stress of the first silicon oxide film.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the trench is formed in a hole shape and the method further comprises forming an electrode in a concavity located within an interior of the first and second silicon oxide films formed in the trench, the electrode being formed so as to be penetrating the semiconductor substrate after reducing the thickness of the semiconductor substrate.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein the depositing the second silicon oxide film comprises repeating a cycle of a deposition of the second silicon oxide film and a subsequent heat treatment at least two times.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein a film thickness of the second silicon oxide film in a direction parallel to the main surface of the semiconductor substrate is 1 to 5 times the film thickness of the first silicon oxide film in the same direction.
5. The method of manufacturing a semiconductor device according to claim 1 , wherein a film thickness of the second silicon oxide film in the direction parallel to the main surface of the semiconductor substrate is 2 to 4 times the film thickness of the first silicon oxide film in the same direction.
6. The method of manufacturing a semiconductor device according to claim 1 , wherein the second silicon oxide film is formed by a CVD method.
7. The method of manufacturing a semiconductor device according to claim 6 , wherein the second silicon oxide film is a non-doped silicate glass formed by a low pressure CVD method with a TEOS as a raw material.
8. The method of manufacturing a semiconductor device according to claim 1 , further comprising performing a heat treatment to the semiconductor substrate after depositing the second silicon oxide film.
9. The method of manufacturing a semiconductor device according to claim 8 , wherein the heat treatment is performed in the range of 900 to 1100° C. at non-oxidizing atmosphere.
10. The method of manufacturing a semiconductor device according to claim 1 , the method further comprises forming a silicon nitride film before depositing the second silicon oxide film.
11. The method of manufacturing a semiconductor device according to claim 1 , wherein the second silicon oxide film is a laminated film of a plurality of silicon oxide layers.
12. A method of manufacturing a semiconductor device comprising:
forming a hole on a main surface of a semiconductor substrate, the semiconductor substrate including silicon;
forming a first silicon oxide film on a sidewall of the hole by thermally oxidizing the silicon of the side wall of the hole;
depositing a second silicon oxide film on the sidewall of the hole; and
reducing a thickness of the semiconductor substrate from a back surface that is located on an opposite side of the main surface to expose a bottom of the hole, wherein:
the first silicon oxide film gives a compressive stress to the semiconductor substrate in a depth direction;
the second silicon oxide film gives a tensile stress to the semiconductor substrate in the depth direction; and
the second silicon oxide film has the film thickness so that the tensile stress is substantially balanced out by the compressive stress of the first silicon oxide film.
13. The method of manufacturing a semiconductor device according to claim 12 , the method further comprises forming an electrode in a concavity located within an interior of the first and second silicon oxide films formed in the hole, the electrode being formed so as to be penetrating the semiconductor substrate after reducing the thickness of the semiconductor substrate.
14. The method of manufacturing a semiconductor device according to claim 12 , wherein the depositing the second silicon oxide film comprises repeating a cycle of a depositing of the second silicon oxide film and a subsequent heat treatment at least two times.
15. The method of manufacturing a semiconductor device according to claim 12 , wherein a film thickness of the second silicon oxide film in a direction parallel to the main surface of the semiconductor substrate is 1 to 5 times the film thickness of the first silicon oxide film in the same direction.
16. The method of manufacturing a semiconductor device according to claim 12 , wherein a film thickness of the second silicon oxide film in a direction parallel to the main surface of the semiconductor substrate is 2 to 4 times the film thickness of the first silicon oxide film in the same direction.
17. The method of manufacturing a semiconductor device according to claim 12 , further comprising performing a heat treatment to the semiconductor substrate after depositing the second silicon oxide film.
18. The method of manufacturing a semiconductor device according to claim 12 , wherein the second silicon oxide film is a laminated film of a plurality of silicon oxide layers.