Light-emitting device and method of manufacturing the same
A light-emitting device and a method of manufacturing the same are provided. The light-emitting device includes a compound semiconductor structure having a first N-type compound semiconductor layer, an active layer, and a P-type compound semiconductor layer, a P-type electrode layer that is disposed on the P-type compound semiconductor layer and electrically connects with the P-type compound semiconductor layer, a plurality of insulation walls disposed at two sides of the compound semiconductor structure and the P-type electrode layer, a plurality of N-type electrode layers penetrating the plurality of insulation walls, and a conductive substrate on which a plurality of N-type electrode connecting layers respectively corresponding to a plurality of N-type electrode layers are separated from a P-type electrode connecting layer corresponding to the P-type electrode layer.
1. A method of manufacturing a light-emitting device, comprising:
forming a plurality of insulation walls on a substrate;
forming a compound semiconductor structure and a P-type electrode layer in an interior space defined by the plurality of insulation walls;
forming corresponding N-type electrode layers in the plurality of insulating walls; and
attaching a conductive substrate in which a plurality of N-type electrode connecting layers are separated from a P-type electrode connecting layer,
wherein the attaching of the conductive substrate comprises:
penetrating the conductive substrate to form a plurality of holes; and
filling each of the plurality of holes with an insulating material and forming a plurality of partition walls separating the P-type electrode connecting layer from the plurality of N-type electrode connecting layers.
2. The method of claim 1 , wherein the forming of the plurality of insulation walls on the substrate comprises:
forming a second N-type compound semiconductor layer on the substrate;
forming an insulating layer on the second N-type compound semiconductor layer; and
patterning the insulating layer to form a plurality of spaced-apart insulation walls on either side of the substrate.
3. The method of claim 2 , wherein the forming of the compound semiconductor structure and the P-type electrode layer comprises sequentially stacking a first N-type compound semiconductor layer, an active layer, and a P-type compound semiconductor layer to form the compound semiconductor structure and forming the P-type electrode layer on the P-type compound semiconductor layer.
4. The method of claim 2 , wherein the forming of the corresponding N-type electrode layers in the plurality of insulating walls comprises penetrating the corresponding plurality of insulation walls to form a plurality of holes extending from top surfaces of the plurality of insulation walls to a top surface of the second N-type compound semiconductor layer and filling the plurality of holes with a metallic material.
5. The method of claim 2 , wherein the second N-type compound semiconductor layer has a concave-convex structure formed on its top surface.
6. The method of claim 5 , further comprising forming a phosphor layer on the concave-convex structure.
7. The method of claim 1 , wherein the plurality of insulation walls are formed on the substrate prior to the forming of the compound semiconductor structure and the P-type electrode layer in the interior space defined by the plurality of insulation walls.
8. A method of manufacturing a light-emitting device, comprising:
forming a plurality of insulation walls on a substrate;
forming a compound semiconductor structure and a P-type electrode layer in an interior space defined by the plurality of insulation walls;
forming corresponding N-type electrode layers in the plurality of insulating walls; and
attaching a conductive substrate in which a plurality of N-type electrode connecting layers are separated from a P-type electrode connecting layer,
wherein the forming of the corresponding N-type electrode layers in the plurality of insulating walls comprises penetrating the corresponding plurality of insulation walls to form a plurality of holes extending from top surfaces of the plurality of insulation walls to a top surface of a second N-type compound semiconductor layer formed on the substrate and filling the plurality of holes with a metallic material, and
wherein the attaching of the conductive substrate comprises:
forming a conductive adhesive layer on the conductive substrate;
penetrating the conductive substrate and the conductive adhesive layer to form a plurality of holes;
filling each of the plurality of holes with an insulating material and forming a plurality of partition walls separating the P-type electrode connecting layer from the plurality of N-type electrode connecting layers; and
attaching the conductive substrate so that the plurality of N-type electrode connecting layers respectively correspond to the plurality of N-type electrode layers and the P-type electrode connecting layer corresponds to the P-type electrode layer.
9. The method of claim 8 , wherein the plurality of partition walls contact with the plurality of insulation walls.
10. The method of claim 9 , further comprising removing the substrate.