Perpendicular magnetic recording transducer with AFM insertion layer
View Patent ↗A magnetic sensor is configured to reside in proximity to a recording medium during use. The sensor includes a magnetic top shield and a magnetic bottom shield. A top sensor stack is under the magnetic top shield and includes magnetic sensing layers. A bottom sensor stack is between the magnetic bottom shield and the top sensor stack. The bottom sensor stack includes a magnetic seed stack above the bottom shield, an insertion stack above the magnetic seed stack, and an antiferromagnetic (AFM) layer on and in contact with the insertion stack. A pinned layer is above the AFM layer. An AFM coupling layer is above the pinned layer. In some aspects the insertion stack may include at least one of Ti, Hf, Zr, and Ta. In some aspect, the insertion stack includes a layer of elemental Ti. In other aspects, the insertion stack includes multilayer structures.
1. A magnetic sensor configured to reside in proximity to a recording medium during use, the magnetic sensor comprising:
a magnetic top shield and a magnetic bottom shield;
a top sensor stack positioned under the top shield;
the top sensor stack comprising magnetic sensing layers;
a bottom sensor stack positioned between the magnetic bottom shield and the top sensor stack, wherein the bottom sensor stack comprises:
a magnetic seed stack positioned above the magnetic bottom shield;
an insertion stack above the magnetic seed stack;
an antiferromagnetic (AFM) layer on and in contact with the insertion stack;
a pinned layer above the AFM layer, and
an AFM coupling layer above the pinned layer,
wherein the insertion stack comprises at least one of Ti, Hf, Zr, and Ta.
2. The magnetic sensor of claim 1 wherein the insertion stack comprises a layer of elemental Ti.
3. The magnetic sensor of claim 1 wherein the thickness of the insertion stack is between 0.1 nanometers (nm) and 0.5 nm.
4. The magnetic sensor of claim 1 wherein the insertion stack comprises an amorphous alloy of at least one of Ti, Hf, Zr, and Ta.
5. The magnetic sensor of claim 1 wherein the insertion stack comprises a plurality of layers.
6. The magnetic sensor of claim 5 wherein the insertion stack comprises at least one layer comprising at least one of Ru, Ir, and Pt.
7. The magnetic sensor of claim 1 wherein the AFM layer comprises IrMn.
8. The magnetic sensor of claim 7 wherein the AFM layer has a thickness of less than 7 nm.
9. The magnetic sensor of claim 1 wherein the insertion stack comprises a layer of elemental Ti and has a thickness between 0.2 nm and 1 nm, and the AFM layer comprises IrMn and has a thickness between 3 nm and 7 nm.
10. The magnetic sensor of claim 1 wherein the AFM layer has a thickness of less than 5.5 nanometers.
11. The magnetic sensor of claim 1 wherein the magnetic sensing layers comprise:
a reference layer above the AFM coupling layer;
a barrier layer above the reference layer;
a free layer above the barrier layer, and
a capping layer above the free layer.
12. The magnetic sensor of claim 11 wherein the reference layer comprises CoFeB.
13. The magnetic sensor of claim 11 wherein the barrier comprises MgO.
14. The magnetic sensor of claim 11 wherein the capping layer comprises Ta.
15. The magnetic sensor of claim 1 wherein the magnetic seed stack comprises at least one of Co, Ni, B, and Fe.
16. The magnetic sensor of claim 1 wherein the magnetic seed stack comprises a multilayer stack, wherein:
a first seed layer comprising CoFeB is above the bottom shield;
a second seed layer comprising NiFe50 is on the first seed layer, and
a third seed layer comprising NiFe5 is on the second seed layer.
17. A disk drive comprising:
a slider including a magnetic sensor configured to reside in proximity to a recording medium during use, the magnetic sensor comprising:
a magnetic top shield and a magnetic bottom shield;
a top sensor stack positioned under the top shield;
the top sensor stack comprising magnetic sensing layers;
a bottom sensor stack positioned between the magnetic bottom shield and the top sensor stack, wherein the bottom sensor stack comprises:
a magnetic seed stack positioned above the magnetic bottom shield;
an insertion stack above the magnetic seed stack;
an antiferromagnetic (AFM) layer on and in contact with the insertion stack;
a pinned layer above the AFM layer, and
an AFM coupling layer above the pinned layer,
wherein the insertion stack comprises at least one of Ti, Hf, Zr, and Ta.
18. The disk drive of claim 17 wherein the thickness of the insertion stack is between 0.1 nanometers (nm) and 0.5 nm.
19. The disk drive of claim 17 wherein the insertion stack comprises an amorphous alloy of at least one of Ti, Hf, Zr, and Ta.
20. The disk drive of claim 17 wherein the insertion stack comprises a plurality of layers, at least one layer comprising at least one of Ti, Hf, Zr, and Ta.
21. The disk drive of claim 20 wherein the insertion stack comprises a plurality of layers, at least one layer comprising at least one of Ru, Ir, and Pt.
22. The disk drive of claim 17 wherein the AFM layer comprises IrMn and has a thickness of less than 7 nm.
23. The disk drive of claim 17 wherein the insertion stack comprises a layer of elemental Ti and has a thickness between 0.2 nm and 1 nm, and the AFM layer comprises IrMn and has a thickness between 3 nm and 7 nm.
24. The disk drive of claim 17 wherein the AFM layer has a thickness of less than 5.5 nanometers.